Issued Patents All Time
Showing 51–75 of 83 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9698028 | Semiconductor package and method of manufacturing the same | Wen-Hsiung Lu, Ming-Da Cheng, Yu-Peng Tsai, Chia-Wei Tu, Chung-Shi Liu | 2017-07-04 |
| 9691738 | Bonding package components through plating | Zheng-Yi Lim, Tzong-Hann Yang, Ming-Che Ho, Chung-Shi Liu | 2017-06-27 |
| 9685372 | Method of forming Cu pillar bump with non-metal sidewall spacer and metal top cap | Chien Ling Hwang, Hui-Jung Tsai, Chung-Shi Liu | 2017-06-20 |
| 9653418 | Packaging devices and methods | Shih-Wei Liang, Kai-Chiang Wu, Ming-Che Ho | 2017-05-16 |
| 9607921 | Package on package interconnect structure | Wen-Hsiung Lu, Chih-Wei Lin, Hsiu-Jen Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-03-28 |
| 9601355 | Via structure for packaging and a method of forming | Ming-Che Ho, Chien Ling Hwang, Hung-Jui Kuo, Chung-Shi Liu | 2017-03-21 |
| 9559070 | Post-passivation interconnect structure and method of forming same | Hsien-Wei Chen | 2017-01-31 |
| 9548283 | Package redistribution layer structure and method of forming same | Tsung-Shu Lin, Hung-Jui Kuo | 2017-01-17 |
| 9524945 | Cu pillar bump with L-shaped non-metal sidewall protection structure | Chien Ling Hwang, Chung-Shi Liu | 2016-12-20 |
| 9418956 | Zero stand-off bonding system and method | Chun-Hung Lin, Ming-Che Ho, Yu-Feng Chen, Hsien-Liang Meng, Han-Ping Pu | 2016-08-16 |
| 9385076 | Semiconductor device with bump structure on an interconncet structure | Hsien-Wei Chen, Wen-Hsiung Lu | 2016-07-05 |
| 9368462 | Methods and apparatus of packaging semiconductor devices | Ming-Che Ho, Wen-Hsiung Lu, Chia-Wei Tu, Chung-Shi Liu | 2016-06-14 |
| 9305856 | Post-passivation interconnect structure AMD method of forming same | Hsien-Wei Chen | 2016-04-05 |
| 9287171 | Method of making a conductive pillar bump with non-metal sidewall protection structure | Cheng-Chung Lin, Chien Ling Hwang, Chung-Shi Liu | 2016-03-15 |
| 9263302 | Via structure for packaging and a method of forming | Ming-Che Ho, Chien Ling Hwang, Hung-Jui Kuo, Chung-Shi Liu | 2016-02-16 |
| 9136167 | Method of making a pillar structure having a non-metal sidewall protection structure | Chien Ling Hwang, Chun-Chieh Wang, Chung-Shi Liu | 2015-09-15 |
| 9117772 | Bonding package components through plating | Zheng-Yi Lim, Tzong-Hann Yang, Ming-Che Ho, Chung-Shi Liu | 2015-08-25 |
| 9099396 | Post-passivation interconnect structure and method of forming the same | Zheng-Yi Lim, Ming-Che Ho, Chung-Shi Liu | 2015-08-04 |
| 9082776 | Semiconductor package having protective layer with curved surface and method of manufacturing same | Wen-Hsiung Lu, Ming-Da Cheng, Yu-Peng Tsai, Chia-Wei Tu, Chung-Shi Liu | 2015-07-14 |
| 9064880 | Zero stand-off bonding system and method | Chun-Hung Lin, Ming-Che Ho, Yu-Feng Chen, Hsien-Liang Meng, Han-Ping Pu | 2015-06-23 |
| 9030010 | Packaging devices and methods | Shih-Wei Liang, Kai-Chiang Wu, Ming-Che Ho | 2015-05-12 |
| 9018758 | Cu pillar bump with non-metal sidewall spacer and metal top cap | Chien Ling Hwang, Hui-Jung Tsai, Chung-Shi Liu | 2015-04-28 |
| 8937388 | Methods and apparatus of packaging semiconductor devices | Ming-Che Ho, Wen-Hsiung Lu, Chia-Wei Tu, Chung-Shi Liu | 2015-01-20 |
| 8865586 | UBM formation for integrated circuits | Zheng-Yi Lim, Ming-Che Ho, Chung-Shi Liu | 2014-10-21 |
| 8841766 | Cu pillar bump with non-metal sidewall protection structure | Chien Ling Hwang, Chun-Chieh Wang, Chung-Shi Liu | 2014-09-23 |