Issued Patents All Time
Showing 76–83 of 83 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8823167 | Copper pillar bump with non-metal sidewall protection structure and method of making the same | Cheng-Chung Lin, Chien Ling Hwang, Chung-Shi Liu | 2014-09-02 |
| 8735273 | Forming wafer-level chip scale package structures with reduced number of seed layers | Wen-Hsiung Lu, Ming-Da Cheng, Chih-Wei Lin, Hsiu-Jen Lin, Chung-Shi Liu +2 more | 2014-05-27 |
| 8659155 | Mechanisms for forming copper pillar bumps | Ming-Da Cheng, Wen-Hsiung Lu, Chih-Wei Lin, Ching-Wen Chen, Chia-Tung Chang +2 more | 2014-02-25 |
| 8587119 | Conductive feature for semiconductor substrate and method of manufacture | Chien Ling Hwang, Chung-Shi Liu | 2013-11-19 |
| 8569887 | Post passivation interconnect with oxidation prevention layer | Chien Ling Hwang, Chung-Shi Liu | 2013-10-29 |
| 8501615 | Metal bump formation | Ming-Da Cheng, Chih-Wei Lin, Hsiu-Jen Lin, Tzong-Hann Yang, Wen-Hsiung Lu +2 more | 2013-08-06 |
| 8441124 | Cu pillar bump with non-metal sidewall protection structure | Cheng-Chung Lin, Chien Ling Hwang, Chung-Shi Liu | 2013-05-14 |
| 8242011 | Method of forming metal pillar | Zheng-Yi Lim, Wen-Hsiung Lu, Chih-Wei Lin, Tzong-Huann Yang, Hsiu-Jen Lin +2 more | 2012-08-14 |