Issued Patents All Time
Showing 26–50 of 83 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11239233 | Integrated circuit packages and methods of forming same | Hung-Jui Kuo, Ming-Che Ho | 2022-02-01 |
| 11133265 | Integrated fan-out package and method of fabricating the same | Yu-Hsiang Hu, Hung-Jui Kuo | 2021-09-28 |
| 11114313 | Wafer level mold chase | Hsien-Wen Liu, Po-Hao Tsai, Shin-Puu Jeng | 2021-09-07 |
| 11101214 | Package structure with dam structure and method for forming the same | Po-Hao Tsai, Techi Wong, Meng-Liang Lin, Po-Yao Chuang, Shin-Puu Jeng | 2021-08-24 |
| 11094625 | Semiconductor package with improved interposer structure | Techi Wong, Po-Hao Tsai, Po-Yao Chuang, Shih-Ting Hung, Shin-Puu Jeng | 2021-08-17 |
| 11024581 | Semiconductor packages and methods of manufacturing the same | Hung-Jui Kuo, Ming-Che Ho | 2021-06-01 |
| 10930586 | Integrated fan-out package and method of fabricating the same | Hung-Jui Kuo, Ming-Che Ho | 2021-02-23 |
| 10872885 | Integrated circuit packages and methods of forming same | Hung-Jui Kuo, Ming-Che Ho | 2020-12-22 |
| 10867941 | Semiconductor device and method | Chen-Hua Yu, Ming-Che Ho, Hung-Jui Kuo, Tzung-Hui Lee | 2020-12-15 |
| 10840212 | Bonding package components through plating | Zheng-Yi Lim, Tzong-Hann Yang, Ming-Che Ho, Chung-Shi Liu | 2020-11-17 |
| 10734341 | Via structure for packaging and a method of forming | Ming-Che Ho, Chien Ling Hwang, Hung-Jui Kuo, Chung-Shi Liu | 2020-08-04 |
| 10700001 | Forming bonding structures by using template layer as templates | Mirng-Ji Lii, Chung-Shi Liu, Chin-Yu Ku, Hung-Jui Kuo, Alexander Kalnitsky +3 more | 2020-06-30 |
| 10510673 | Integrated fan-out package and method of fabricating the same | Yu-Hsiang Hu, Hung-Jui Kuo | 2019-12-17 |
| 10483230 | Bonding package components through plating | Zheng-Yi Lim, Tzong-Hann Yang, Ming-Che Ho, Chung-Shi Liu | 2019-11-19 |
| 10461051 | Via structure for packaging and a method of forming | Ming-Che Ho, Chien Ling Hwang, Hung-Jui Kuo, Chung-Shi Liu | 2019-10-29 |
| 10297544 | Integrated fan-out package and method of fabricating the same | Hung-Jui Kuo, Ming-Che Ho | 2019-05-21 |
| 10297560 | Semiconductor device and method | Chen-Hua Yu, Ming-Che Ho, Hung-Jui Kuo, Tzung-Hui Lee | 2019-05-21 |
| 10163837 | Cu pillar bump with L-shaped non-metal sidewall protection structure | Chien Ling Hwang, Chung-Shi Liu | 2018-12-25 |
| 10134700 | Via structure for packaging and a method of forming | Ming-Che Ho, Chien Ling Hwang, Hung-Jui Kuo, Chung-Shi Liu | 2018-11-20 |
| 10079200 | Packaging devices and methods | Shih-Wei Liang, Kai-Chiang Wu, Ming-Che Ho | 2018-09-18 |
| 10068853 | Integrated fan-out package and method of fabricating the same | Yu-Hsiang Hu, Hung-Jui Kuo | 2018-09-04 |
| 9953891 | Method of forming post-passivation interconnect structure | Zheng-Yi Lim, Ming-Che Ho, Chung-Shi Liu | 2018-04-24 |
| 9935047 | Bonding structures and methods forming the same | Mirng-Ji Lii, Chung-Shi Liu, Chin-Yu Ku, Hung-Jui Kuo, Alexander Kalnitsky +3 more | 2018-04-03 |
| 9871009 | Semiconductor device and method | Chen-Hua Yu, Ming-Che Ho, Hung-Jui Kuo, Tzung-Hui Lee | 2018-01-16 |
| 9859242 | Post-passivation interconnect structure and method of forming same | Hsien-Wei Chen | 2018-01-02 |