Issued Patents All Time
Showing 251–275 of 299 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8404544 | Fabrication methods of integrated semiconductor structure | Jin-Mu Yin, Shyh-Wei Wang | 2013-03-26 |
| 8362573 | Integrated circuits and manufacturing methods thereof | Chung-Cheng Wu, Ali Keshavarzi, Ka-Hing Fung, Ta-Pen Guo, Jiann-Tyng Tzeng +6 more | 2013-01-29 |
| 8236659 | Source and drain feature profile for improving device performance and method of manufacturing same | Ming-Huan Tsai, Chun-Fai Cheng, Hui Ouyang, Yuan-Hung Chiu | 2012-08-07 |
| 7906425 | Fluxless bumping process | Chao-Yuan Su, Chia-Fu Lin, Hsin-Hui Lee, Kai-Ming Ching, Li-Chih Chen +2 more | 2011-03-15 |
| 7816169 | Colors only process to reduce package yield loss | Yang-Tung Fan, Chiou-Shian Peng, Cheng-Yu Chu, Shih-Jane Lin, Fu-Jier Fan +1 more | 2010-10-19 |
| 7767590 | Semiconductor device with spacer having batch and non-batch layers | Lin Wu | 2010-08-03 |
| 7652893 | Single or dual electronic package with footprint and pin sharing | — | 2010-01-26 |
| 7485906 | Colors only process to reduce package yield loss | Yang-Tung Fan, Chiou-Shian Peng, Cheng-Yu Chu, Shih-Jane Lin, Fu-Jier Fan +1 more | 2009-02-03 |
| 7468321 | Application of impressed-current cathodic protection to prevent metal corrosion and oxidation | Kai-Ming Ching, Chia-Fu Lin, Wen-Hsiang Tseng, Ta-Min Lin, Hsin-Hui Lee +1 more | 2008-12-23 |
| 7460070 | Chip antenna | Chao Wang, Chang-Fa Yang, Shun-Iian Lin, Chuan-Lin Hu, Chang-Lun Liao +1 more | 2008-12-02 |
| 7439921 | Chip antenna apparatus for receiving global positioning system signals | Chuan-Lin Hu, Yu-Wei Chen, Chang-Lun Liao, Shun-Tian Lin, Chang-Fa Yang +1 more | 2008-10-21 |
| 7310068 | Chip antenna mounting apparatus | Chuan-Lin Hu, Yu-Wei Chen, Chang-Lun Liao, Shun-Tian Lin, Chang-Fa Yang +1 more | 2007-12-18 |
| 7276454 | Application of impressed-current cathodic protection to prevent metal corrosion and oxidation | Kai-Ming Ching, Chia-Fu Lin, Wen-Hsiang Tseng, Ta-Min Lin, Hsin-Hui Lee +2 more | 2007-10-02 |
| 7220650 | Sidewall spacer for semiconductor device and fabrication method thereof | Rong-Hui Kao, Chang-Sheng Tsao, Lin-June Wu | 2007-05-22 |
| 7183598 | Colors only process to reduce package yield loss | Yang-Tung Fan, Chiou-Shian Peng, Cheng-Yu Chu, Shih-Jane Lin, Fu-Jier Fan +1 more | 2007-02-27 |
| 7160811 | Laminated silicate glass layer etch stop method for fabricating microelectronic product | Huan Chi Tseng, Yu-Hua Lee, Dian-Hau Chen, Chia-Hung Lai, Kang-Min Kuo | 2007-01-09 |
| 7134199 | Fluxless bumping process | Chao-Yuan Su, Chia-Fu Lin, Hsin-Hui Lee, Kai-Ming Ching, Li-Chih Chen +2 more | 2006-11-14 |
| 7091098 | Semiconductor device with spacer having batch and non-batch layers | Lin Wu | 2006-08-15 |
| 6974659 | Method of forming a solder ball using a thermally stable resinous protective layer | Chao-Yuan Su, Chia-Fu Lin, Hsin-Hui Lee, Kai-Ming Ching, Li-Chih Chen | 2005-12-13 |
| 6956292 | Bumping process to increase bump height and to create a more robust bump structure | Yang-Tung Fan, Cheng-Yu Chu, Fu-Jier Fan, Shih-Jane Lin, Chiou-Shian Peng +1 more | 2005-10-18 |
| 6936923 | Method to form very a fine pitch solder bump using methods of electroplating | Kuo-Wei Lin, Cheng-Yu Chu, Yang-Tung Fan, Fu-Jier Fan, Chiou-Shian Peng +1 more | 2005-08-30 |
| 6923683 | High density interconnection device | Harjinder Dulai, Colin Szeto, Edward J. Laurin, Steven D. Daniels, Jean-Francois Drolet | 2005-08-02 |
| 6876049 | Colors only process to reduce package yield loss | Yang-Tung Fan, Chiou-Shian Peng, Cheng-Yu Chu, Shih-Jane Lin, Fu-Jier Fan +1 more | 2005-04-05 |
| 6818565 | Gate insulator pre-clean procedure | Yeuh-Mao Sun, Yan-Fei Lin, Lin Wu | 2004-11-16 |
| 6802250 | Stencil design for solder paste printing | Chao-Yuan Su, Chia-Fu Lin, Hsin-Hui Lee, Kai-Ming Ching, Li-Chih Chen | 2004-10-12 |