Issued Patents All Time
Showing 276–299 of 299 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6797075 | Ferris wheel-like stripping or cleaning mechanism for semiconductor fabrication | Kai-Ming Ching, Chia-Fu Lin, Wen-Hsiang Tseng, Ta-Min Lin, Hsin-Hui Lee | 2004-09-28 |
| D494544 | High density interconnection device | Harjinder Dulai, Colin Szeto, Edward J. Laurin, Steven D. Daniels, Jean-Francois Drolet | 2004-08-17 |
| 6765277 | Microelectronic fabrication with corrosion inhibited bond pad | Chia-Fu Lin, Yang-Tung Fan, Hong-Wen Huang, Cheng-Yu Chu | 2004-07-20 |
| 6756294 | Method for improving bump reliability for flip chip devices | Chia-Fu Lin, Shun-Liang Hsu, Kai-Ming Ching, Hsin-Hui Lee, Chao-Yuan Su +1 more | 2004-06-29 |
| 6743660 | Method of making a wafer level chip scale package | Hsin-Hui Lee, Chia-Fu Lin, Chao-Yuan Su, Kai-Ming Ching, Li-Chih Chen | 2004-06-01 |
| 6715524 | DFR laminating and film removing system | Li-Chen Chen, Chia-Tsun Hsu, Chia-Fu Lin, Kuo-Ching Lee, Kai-Ming Ching +2 more | 2004-04-06 |
| 6649507 | Dual layer photoresist method for fabricating a mushroom bumping plating structure | Cheng-Yu Chu, Kuo-Wei Lin, Chiou-Shian Peng, Yang-Tung Fan, Fu-Jier Fan +1 more | 2003-11-18 |
| 6638688 | Selective electroplating method employing annular edge ring cathode electrode contact | Kai-Ming Ching, Sheng-Liang Pan, Hao-Wei Chang, Chun-Hong Chang | 2003-10-28 |
| 6636313 | Method of measuring photoresist and bump misalignment | Chia-Fu Lin, Kai-Ming Ching, Chao-Yuan Su, Hsin-Hui Lee, Li-Chih Chen | 2003-10-21 |
| 6632700 | Method to form a color image sensor cell while protecting the bonding pad structure from damage | Yang-Tung Fan, Cheng-Yu Chu, Chiou-Shian Peng, Shih-Jane Lin, Fu-Jier Fan +1 more | 2003-10-14 |
| 6605524 | Bumping process to increase bump height and to create a more robust bump structure | Yang-Tung Fan, Cheng-Yu Chu, Fu-Jier Fan, Shih-Jane Lin, Chiou-Shian Peng +1 more | 2003-08-12 |
| 6602775 | Method to improve reliability for flip-chip device for limiting pad design | Chia-Fu Lin, Kai-Ming Ching, Hsin-Hui Lee, Chao-Yuan Su, Li-Chi Chen | 2003-08-05 |
| 6583039 | Method of forming a bump on a copper pad | Kuo-Wei Lin, Cheng-Yu Chu, Yang-Tung Fan, Fu-Jier Fan, Shih-Jane Lin +2 more | 2003-06-24 |
| 6482669 | Colors only process to reduce package yield loss | Yang-Tung Fan, Chiou-Shian Peng, Cheng-Yu Chu, Shih-Jane Lin, Fu-Jier Fan +1 more | 2002-11-19 |
| 6472719 | Method of manufacturing air gap in multilevel interconnection | Shih-Chi Lin, Juin-Jie Chang, Kuei-Wu Huang | 2002-10-29 |
| 6426281 | Method to form bump in bumping technology | Kuo-Wei Lin, Cheng-Yu Chu, Yang-Tung Fan, Fu-Jier Fan, Chiou-Shian Peng +1 more | 2002-07-30 |
| 6426283 | Method for bumping and backlapping a semiconductor wafer | Kuo-Wei Lin, Cheng-Yu Chu, Fu-Jier Fan, Yang-Tung Fan, Chiou-Shian Peng +1 more | 2002-07-30 |
| 6372545 | Method for under bump metal patterning of bumping process | Fu-Jier Fan, Kuo-Wei Lin, Cheng-Yu Chu, Shih-Jane Lin, Chiou-Shian Peng +1 more | 2002-04-16 |
| 6211057 | Method for manufacturing arch air gap in multilevel interconnection | Shih-Chi Lin | 2001-04-03 |
| 6130151 | Method of manufacturing air gap in multilevel interconnection | Shih-Chi Lin, Juin-Jie Chang, Kuei-Wu Huang | 2000-10-10 |
| 6077733 | Method of manufacturing self-aligned T-shaped gate through dual damascene | Wei-Jen Liu, Shih-Chi Lin, Kuo-Chou Liu | 2000-06-20 |
| 6069063 | Method to form polysilicon resistors shielded from hydrogen intrusion | Juin-Jie Chang, Shih-Chi Lin, Yung-Lung Hsu | 2000-05-30 |
| 5950094 | Method for fabricating fully dielectric isolated silicon (FDIS) | Shih-Chi Lin, Hui Yu, Hui-Hua Chang | 1999-09-07 |
| 4654140 | Pressure indicating device for indicating clogging condition of a filter | — | 1987-03-31 |