Issued Patents All Time
Showing 76–100 of 303 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749756 | Method for manufacturing semiconductor device | Che-Yu Lin, Ming-Hua Yu, Chan-Lon Yang | 2023-09-05 |
| 11749752 | Doping profile for strained source/drain region | Hsueh-Chang Sung, Tsz-Mei Kwok, Kun-Mu Li, Chii-Horng Li | 2023-09-05 |
| 11742399 | Topology selective and sacrificial silicon nitride layer for generating spacers for a semiconductor device drain | Tzu-Yang Ho, Tsai-Jung Ho, Jr-Hung Li | 2023-08-29 |
| 11726405 | Photoresist for semiconductor fabrication | Chih-Cheng Liu, Yi-Chen Kuo, Yen-Yu Chen, Jr-Hung Li, Chi-Ming Yang | 2023-08-15 |
| 11725278 | Systems and methods for a plasma enhanced deposition of material on a semiconductor substrate | Kun-Mo Lin, Yi-Hung Lin, Jr-Hung Li, Ting-Gang Chen, Chung-Ting Ko | 2023-08-15 |
| 11715640 | Patterning material including silicon-containing layer and method for semiconductor device fabrication | Szu-Ping Tung, Chun-Kai Chen, Yi-Nien Su | 2023-08-01 |
| 11705332 | Photoresist layer surface treatment, cap layer, and method of forming photoresist pattern | Yi-Chen Kuo, Chih-Cheng Liu, Ming-Hui Weng, Jia-Lin WEI, Yen-Yu Chen +4 more | 2023-07-18 |
| 11676855 | Patterning interconnects and other structures by photo-sensitizing method | Wei-Jen Lo, Po-Cheng Shih, Syun-Ming Jang | 2023-06-13 |
| 11676852 | Patterning methods for semiconductor devices | Wei-Ren Wang, Shing-Chyang Pan, Ching-Yu Chang, Wan-Lin Tsai, Jung-Hau Shiu | 2023-06-13 |
| 11670546 | Semiconductor structure and manufacturing method thereof | Yu-Kai Lin, Su-Jen Sung, Jen Hung Wang | 2023-06-06 |
| 11670500 | Treatment system and method | Wan-Yi Kao, Kuang-Yuan Hsu | 2023-06-06 |
| 11652106 | Semiconductor device and method for making the same | Pei-Yu Chou, Yi-Ting Fu, Ting-Gang Chen | 2023-05-16 |
| 11588030 | Integrated circuit structure and manufacturing method thereof | — | 2023-02-21 |
| 11502196 | Stress modulation for dielectric layers | Chung-Ting Ko, Han-Chi Lin, Chunyao Wang, Ching-Yu Huang, Yung-Chih Wang | 2022-11-15 |
| 11482411 | Semiconductor device and method | Ching-Yu Chang, Jei-Ming Chen | 2022-10-25 |
| 11441221 | Method of performing atomic layer deposition | Po-Hsien Cheng, Chung-Ting Ko, Tsung-Hsun Yu, Chi On Chui | 2022-09-13 |
| 11437515 | Source and drain stressors with recessed top surfaces | Kun-Mu Li, Tsz-Mei Kwok, Hsueh-Chang Sung, Chii-Horng Li | 2022-09-06 |
| 11437277 | Forming isolation regions for separating fins and gate stacks | Chung-Ting Ko, Tai-Chun Huang, Jr-Hung Li, Chi On Chui | 2022-09-06 |
| 11411109 | MOS devices having epitaxy regions with reduced facets | Hsueh-Chang Sung, Kun-Mu Li, Chii-Horng Li, Tsz-Mei Kwok | 2022-08-09 |
| 11395373 | Wafer holder with tapered region | Yi-Hung Lin, Li-Ting Wang | 2022-07-19 |
| 11393674 | Forming low-stress silicon nitride layer through hydrogen treatment | Wei-Che Hsieh, Ching-Yu Huang, Hsin-Hao Yeh, Chunyao Wang | 2022-07-19 |
| 11373947 | Methods of forming interconnect structures of semiconductor device | Chia-Cheng Chou, Chung-Chi Ko | 2022-06-28 |
| 11342444 | Dielectric spacer to prevent contacting shorting | Ting-Gang Chen, Tai-Chun Huang, Ming-Chang Wen, Shu-Yuan Ku, Fu-Kai Yang +2 more | 2022-05-24 |
| 11328952 | Interconnect structure and method | Chia-Cheng Chou, Chih-Chien Chi, Chung-Chi Ko, Yao-Jen Chang, Chen-Yuan Kao +3 more | 2022-05-10 |
| 11289417 | Semiconductor device and methods of forming the same | Pei-Yu Chou, Jr-Hung Li, Liang-Yin Chen, Su-Hao Liu, Meng-Han Chou +4 more | 2022-03-29 |