Issued Patents All Time
Showing 126–150 of 303 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10797173 | MOS devices with non-uniform p-type impurity profile | Hsueh-Chang Sung, Tsz-Mei Kwok, Kun-Mu Li, Chii-Horng Li | 2020-10-06 |
| 10796898 | Treatment system and method | Wan-Yi Kao, Kuang-Yuan Hsu | 2020-10-06 |
| 10784375 | Source/drain recess in a semiconductor device | Eric Peng, Chao-Cheng Chen, Chii-Horng Li, Ming-Hua Yu, Shih-Hao Lo +2 more | 2020-09-22 |
| 10734520 | MOS devices having epitaxy regions with reduced facets | Hsueh-Chang Sung, Kun-Mu Li, Chii-Horng Li, Tsz-Mei Kwok | 2020-08-04 |
| 10727342 | Source and drain stressors with recessed top surfaces | Kun-Mu Li, Tsz-Mei Kwok, Hsueh-Chang Sung, Chii-Horng Li | 2020-07-28 |
| 10727045 | Method for manufacturing a semiconductor device | Wan-Lin Tsai, Jung-Hau Shiu, Ching-Yu Chang, Jen Hung Wang, Shing-Chyang Pan | 2020-07-28 |
| 10720526 | Stress modulation for dielectric layers | Chung-Ting Ko, Han-Chi Lin, Chunyao Wang, Ching-Yu Huang, Yung-Chih Wang | 2020-07-21 |
| 10672866 | Seamless gap fill | Yen-Chun Huang, Bor Chiuan Hsieh, Pei-Ren Jeng, Tai-Chun Huang | 2020-06-02 |
| 10529553 | Treatment system and method | Wan-Yi Kao, Kuang-Yuan Hsu | 2020-01-07 |
| 10519545 | Systems and methods for a plasma enhanced deposition of material on a semiconductor substrate | Kun-Mo Lin, Yi-Hung Lin, Jr-Hung Li, Ting-Gang Chen, Chung-Ting Ko | 2019-12-31 |
| 10515822 | Method for preventing bottom layer wrinkling in a semiconductor device | Jung-Hau Shiu, Chung-Chi Ko, Yu-Yun Peng | 2019-12-24 |
| 10510584 | Via patterning using multiple photo multiple etch | Jung-Hau Shiu, Chung-Chi Ko, Wen-Kuo Hsieh, Yu-Yun Peng | 2019-12-17 |
| 10510585 | Multi-patterning to form vias with straight profiles | Chun-Kai Chen, Jung-Hau Shiu, Chia-Cheng Chou, Chung-Chi Ko, Chih-Hao Chen +1 more | 2019-12-17 |
| 10510867 | FinFETs and methods of forming the same | Bor Chiuan Hsieh, Chung-Ting Ko, Ting-Gang Chen, Chien-Chung Huang, Tai-Chun Huang | 2019-12-17 |
| 10494716 | Apparatus and method for spatial atomic layer deposition | Anthony Hong Lin, Ching-Lun Lai, Pei-Ren Jeng | 2019-12-03 |
| 10490648 | Method to reduce etch variation using ion implantation | Tsan-Chun Wang, Ziwei Fang, Chii-Horng Li, Chao-Cheng Chen, Syun-Ming Jang | 2019-11-26 |
| 10475926 | MOS devices having epitaxy regions with reduced facets | Hsueh-Chang Sung, Kun-Mu Li, Chii-Horng Li, Tsz-Mei Kwok | 2019-11-12 |
| 10443127 | System and method for supplying a precursor for an atomic layer deposition (ALD) process | Bor Chiuan Hsieh, Chien-Kuo Huang, Tai-Chun Huang, Kuang-Yuan Hsu | 2019-10-15 |
| 10435811 | Wafer susceptor with improved thermal characteristics | Yi-Hung Lin, Jr-Hung Li, Chang-Shen Lu, Chii-Horng Li | 2019-10-08 |
| 10388792 | FinFET with rounded source/drain profile | Ming-Hua Yu, Chih-Pin Tsao, Pei-Ren Jeng | 2019-08-20 |
| 10361112 | High aspect ratio gap fill | Wan-Lin Tsai, Shing-Chyang Pan, Sung-En Lin, Jung-Hau Shiu, Jen Hung Wang | 2019-07-23 |
| 10340178 | Via patterning using multiple photo multiple etch | Jung-Hau Shiu, Chung-Chi Ko, Wen-Kuo Hsieh, Yu-Yun Peng | 2019-07-02 |
| 10325994 | Semiconductor device and method of forming vertical structure | Chih-Tang Peng, Tai-Chun Huang, Teng-Chun Tsai, Cheng-Tung Lin, De-Fang Chen +4 more | 2019-06-18 |
| 10316411 | Injector for forming films respectively on a stack of wafers | Wei-Che Hsieh, Brian Wang, Yi-Hung Lin, Hao-Ming Lien, Shiang-Rung Tsai +1 more | 2019-06-11 |
| 10312075 | Treatment system and method | Wan-Yi Kao, Kuang-Yuan Hsu | 2019-06-04 |