Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12068317 | Integrated circuit with anti-punch through control | Yi-Chen Ho, Chien LIN, Tzu-Wei Lin, Ju Ru Hsieh, Ming-Kai LO | 2024-08-20 |
| 12009208 | Deposition equipment with adjustable temperature source | Chih Yung Hung, Shahaji B. More, Chien-Feng Lin, Cheng-Han Lee, Shih-Chieh Chang +1 more | 2024-06-11 |
| 11715639 | Semiconductor device and fabrication method therefor | Yuan-Chun Sie, Po-Yi Tseng, Chien-Hao Chen, David Sung, Ming-Feng Hsieh +1 more | 2023-08-01 |
| 11315921 | Integrated circuit with anti-punch through control | Yi-Chen Ho, Chien-Feng Lin, Tzu-Wei Lin, Ju Ru Hsieh, Ming-Kai LO | 2022-04-26 |
| 11183405 | Semiconductor manufacturing apparatus | Chao-Tzung Tsai, Tzu Ken Lin, I-Chang Wu, Li-Jia Liou | 2021-11-23 |
| 11008654 | Apparatus and method for spatial atomic layer deposition | Anthony Hong Lin, Pei-Ren Jeng, Tze-Liang Lee | 2021-05-18 |
| 10494716 | Apparatus and method for spatial atomic layer deposition | Anthony Hong Lin, Pei-Ren Jeng, Tze-Liang Lee | 2019-12-03 |
| 10269599 | Semiconductor manufacturing apparatus | Chao-Tzung Tsai, Tzu Ken Lin, I-Chang Wu, Li-Jia Liou | 2019-04-23 |
| 10161039 | Apparatus and method for spatial atomic layer deposition | Anthony Hong Lin, Pei-Ren Jeng, Tze-Liang Lee | 2018-12-25 |
| 10043892 | Method for manufacturing a semiconductor device | Chia-Ying Li, Ming-Shiou Kuo, Wei Wu, Zong-Han Li | 2018-08-07 |
| 9873943 | Apparatus and method for spatial atomic layer deposition | Anthony Hong Lin, Pei-Ren Jeng, Tze-Liang Lee | 2018-01-23 |
| 9871137 | Method for forming semiconductor device structure | Shin-Yeh Huang, Kai-Hsiang Chang, Chih-Chen Jiang, Yi-Wei Peng, Kuan-Yu Lin +1 more | 2018-01-16 |
| 9478617 | Method for forming semiconductor device structure | Shin-Yeh Huang, Kai-Hsiang Chang, Chih-Chen Jiang, Yi-Wei Peng, Kuan-Yu Lin +1 more | 2016-10-25 |
| 9202916 | Semiconductor device structure | Shin-Yeh Huang, Kai-Hsiang Chang, Chih-Chen Jiang, Yi-Wei Peng, Kuan-Yu Lin +1 more | 2015-12-01 |
| 6828255 | Crack inhibited composite dielectric layer | Shi-Wei Wang | 2004-12-07 |