Issued Patents All Time
Showing 51–75 of 109 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157785 | Semiconductor device and method | Yu-Sheng Wang, Chi-Cheng Hung, Ching-Hwanq Su, Liang-Yueh Ou Yang, Yu-Ting Lin | 2018-12-18 |
| 10050116 | Semiconductor device structure and method for forming the same | Hsiao-Ping Liu, Hung-Chang Hsu, Hung-Wen Su, Rueijer Lin, Sheng-Hsuan Lin +2 more | 2018-08-14 |
| 9978681 | Semiconductor device | Hung-Wen Su, Shih-Wei Chou | 2018-05-22 |
| 9978601 | Methods for pre-deposition treatment of a work-function metal layer | Cheng-Yen Tsai, Hsin-Yi Lee, Chung-Chiang Wu, Da-Yuan Lee, Weng Chang | 2018-05-22 |
| 9966448 | Method of making a silicide beneath a vertical structure | Cheng-Tung Lin, Teng-Chun Tsai, Li-Ting Wang, De-Fang Chen, Huang-Yi Huang +2 more | 2018-05-08 |
| 9953868 | Mechanisms of forming damascene interconnect structures | Chien-An Chen, Wen-Jiun Liu, Chun-Chieh Lin, Hung-Wen Su, Syun-Ming Jang | 2018-04-24 |
| 9947540 | Pre-deposition treatment and atomic layer deposition (ALD) process and structures formed thereby | Cheng-Yen Tsai, Da-Yuan Lee, JoJo Lee, Hsueh Wen Tsau, Weng Chang +2 more | 2018-04-17 |
| 9887072 | Systems and methods for integrated resputtering in a physical vapor deposition chamber | Shing-Chyang Pan, Ching-Hua Hsieh, Syun-Ming Jang | 2018-02-06 |
| 9824969 | Semiconductor structure and methods of forming the same | Chung-Chiang Wu, Chia-Ching Lee, Hsueh Wen Tsau, Chun-Yuan Chou, Cheng-Yen Tsai +1 more | 2017-11-21 |
| 9818834 | Semiconductor device structure and method for forming the same | Hsiao-Ping Liu, Hung-Chang Hsu, Hung-Wen Su, Rueijer Lin, Sheng-Hsuan Lin +2 more | 2017-11-14 |
| 9805968 | Vertical structure having an etch stop over portion of the source | Cheng-Tung Lin, Teng-Chun Tsai, Li-Ting Wang, De-Fang Chen, Bing Chen +3 more | 2017-10-31 |
| 9601344 | Method of forming pattern for semiconductor device | Chia-Ying Lee, Chih-Yuan Ting, Jyu-Horng Shieh, Syun-Ming Jang | 2017-03-21 |
| 9577093 | Vertical structure and method of forming semiconductor device | Cheng-Tung Lin, Teng-Chun Tsai, Li-Ting Wang, De-Fang Chen, Bing Chen +3 more | 2017-02-21 |
| 9520362 | Semiconductor device having interconnect layer that includes dielectric segments interleaved with metal components | Chun-Chieh Lin, Hung-Wen Su, Syun-Ming Jang | 2016-12-13 |
| 9437485 | Method for line stress reduction through dummy shoulder structures | Cheng-Cheng Kuo, Tzu-Chun Lo, Ken-Yu Chang, Jye-Yen Cheng, Jeng-Shiun Ho +2 more | 2016-09-06 |
| 9397047 | Interconnect structure and method of forming the same | Jeng-Shiou Chen, Chih-Yuan Ting, Jyu-Horng Shieh | 2016-07-19 |
| 9269612 | Mechanisms of forming damascene interconnect structures | Chien-An Chen, Wen-Jiun Liu, Chun-Chieh Lin, Hung-Wen Su, Syun-Ming Jang | 2016-02-23 |
| 9218970 | Stress-controlled formation of TiN hard mask | Rueijer Lin, Chun-Chieh Lin, Hung-Wen Su | 2015-12-22 |
| 9166001 | Vertical structure and method of forming semiconductor device | Cheng-Tung Lin, Teng-Chun Tsai, Li-Ting Wang, De-Fang Chen, Bing Chen +3 more | 2015-10-20 |
| 9123781 | Semiconductor device and method for forming the same | Hung-Wen Su, Shih-Wei Chou | 2015-09-01 |
| 8785321 | Low resistance and reliable copper interconnects by variable doping | Ting-Chu Ko, Chien-Hsueh Shih | 2014-07-22 |
| 8053892 | Low resistance and reliable copper interconnects by variable doping | Ting-Chu Ko, Chien-Hsueh Shih | 2011-11-08 |
| 7749896 | Semiconductor device and method for forming the same | Hung-Wen Su, Shih-Wei Chou | 2010-07-06 |
| 7638859 | Interconnects with harmonized stress and methods for fabricating the same | Yung-Cheng Lu | 2009-12-29 |
| 7597787 | Methods and apparatuses for electrochemical deposition | Hung-Wen Su | 2009-10-06 |