Issued Patents All Time
Showing 26–50 of 109 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527476 | Interconnect structure of semiconductor device | Yao-Min Liu, Chia-Pang Kuo, Chien-Chung Huang, Chih-Yi Chang, Ya-Lien Lee +2 more | 2022-12-13 |
| 11411094 | Contact with a silicide region | Yu-Wen Cheng, Cheng-Tung Lin, Chih-Wei Chang, Hong-Mao Lee, Sheng-Hsuan Lin +6 more | 2022-08-09 |
| 11410880 | Phase control in contact formation | Chun-Hsien Huang, I-Li Chen, Pin-Wen Chen, Yuan-Chen Hsu, Wei-Jung Lin +1 more | 2022-08-09 |
| 11373905 | Semiconductor device pre-cleaning | Li-Wei Chu, Ying-Chi SU, Yu-Kai Chen, Wei-Yip Loh, Hung-Hsu Chen +1 more | 2022-06-28 |
| 11335774 | Contact structure for semiconductor device and method | Yan-Ming Tsai, Chih-Wei Chang, Sheng-Hsuan Lin, Hung-Hsu Chen, Wei-Yip Loh | 2022-05-17 |
| 11232947 | Ammonium fluoride pre-clean protection | Li-Wei Chu, Ying-Chi SU, Yu-Kai Chen, Wei-Yip Loh, Hung-Hsu Chen +1 more | 2022-01-25 |
| 11222818 | Formation method of semiconductor device structure with metal-semiconductor compound region | Yi-Hsiang Chao, Min-Hsiu Hung, Chun-Wen Nieh, Ya-Huei Li, Yu-Hsiang Liao +7 more | 2022-01-11 |
| 11195791 | Method for forming semiconductor contact structure | Yu-Wen Cheng, Wei-Yip Loh, Yu-Hsiang Liao, Sheng-Hsuan Lin, Hong-Mao Lee +4 more | 2021-12-07 |
| 11062941 | Contact conductive feature formation and structure | Ken-Yu Chang, Chun-I Tsai, Wei-Jung Lin | 2021-07-13 |
| 10998269 | Chemical direct pattern plating method | Wen-Jiun Liu, Chen-Yuan Kao, Hung-Wen Su, Syun-Ming Jang | 2021-05-04 |
| 10971396 | Conductive feature formation and structure | Yu-Shih Wang, Chun-I Tsai, Shian Wei Mao, Ken-Yu Chang, Wei-Jung Lin | 2021-04-06 |
| 10943823 | Conductive feature formation and structure using bottom-up filling deposition | Pin-Wen Chen, Chia-Han Lai, Chih-Wei Chang, Mei-Hui Fu, Wei-Jung Lin +3 more | 2021-03-09 |
| 10867845 | Semiconductor device and method | Yu-Sheng Wang, Chi-Cheng Hung, Ching-Hwanq Su, Liang-Yueh Ou Yang, Yu-Ting Lin | 2020-12-15 |
| 10692814 | Chemical direct pattern plating method | Wen-Jiun Liu, Chen-Yuan Kao, Hung-Wen Su, Syun-Ming Jang | 2020-06-23 |
| 10580693 | Contact conductive feature formation and structure | Ken-Yu Chang, Chun-I Tsai, Wei-Jung Lin | 2020-03-03 |
| 10535748 | Method of forming a contact with a silicide region | Yu-Wen Cheng, Cheng-Tung Lin, Chih-Wei Chang, Hong-Mao Lee, Sheng-Hsuan Lin +6 more | 2020-01-14 |
| 10515788 | Systems and methods for integrated resputtering in a physical vapor deposition chamber | Shing-Chyang Pan, Ching-Hua Hsieh, Syun-Ming Jang | 2019-12-24 |
| 10504834 | Contact structure and the method of forming the same | Yu-Wen Cheng, Wei-Yip Loh, Yu-Hsiang Liao, Sheng-Hsuan Lin, Hong-Mao Lee +4 more | 2019-12-10 |
| 10497615 | Semiconductor device and method | Yu-Sheng Wang, Chi-Cheng Hung, Ching-Hwanq Su, Liang-Yueh Ou Yang, Yu-Ting Lin | 2019-12-03 |
| 10475702 | Conductive feature formation and structure using bottom-up filling deposition | Pin-Wen Chen, Chia-Han Lai, Chih-Wei Chang, Mei-Hui Fu, Wei-Jung Lin +3 more | 2019-11-12 |
| 10361120 | Conductive feature formation and structure | Yu-Shih Wang, Chun-I Tsai, Shian Wei Mao, Ken-Yu Chang, Wei-Jung Lin | 2019-07-23 |
| 10297453 | Pre-deposition treatment and atomic layer deposition (ALD) process and structures formed thereby | Cheng-Yen Tsai, Da-Yuan Lee, JoJo Lee, Hsueh Wen Tsau, Weng Chang +2 more | 2019-05-21 |
| 10262944 | Semiconductor device having interconnect layer that includes dielectric segments interleaved with metal components | Chun-Chieh Lin, Hung-Wen Su, Syun-Ming Jang | 2019-04-16 |
| 10170417 | Semiconductor structure | Chung-Chiang Wu, Chia-Ching Lee, Hsueh Wen Tsau, Chun-Yuan Chou, Cheng-Yen Tsai +1 more | 2019-01-01 |
| 10163719 | Method of forming self-alignment contact | Hsiao-Ping Liu, Hung-Chang Hsu, Hung-Wen Su, Rueijer Lin, Sheng-Hsuan Lin +3 more | 2018-12-25 |