Issued Patents All Time
Showing 101–109 of 109 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6309964 | Method for forming a copper damascene structure over tungsten plugs with improved adhesion, oxidation resistance, and diffusion barrier properties using nitridation of the tungsten plug | Shaulin Shue | 2001-10-30 |
| 6303498 | Method for preventing seed layer oxidation for high aspect gap fill | Sheng-Hsiung Chen | 2001-10-16 |
| 6300250 | Method of forming bumps for flip chip applications | — | 2001-10-09 |
| 6274484 | Fabrication process for low resistivity tungsten layer with good adhesion to insulator layers | Sheng-Hsiung Cheu | 2001-08-14 |
| 6235637 | Method for marking a wafer without inducing flat edge particle problem | Sheng-Hsiung Chen | 2001-05-22 |
| 6224737 | Method for improvement of gap filling capability of electrochemical deposition of copper | Wen-Jye Tsai, Shau-Lin Shue, Chen-Hua Yu | 2001-05-01 |
| 6140241 | Multi-step electrochemical copper deposition process with improved filling capability | Shau-Lin Shue, Wen-Jye Tsai, Chen-Hua Yu | 2000-10-31 |
| 6133144 | Self aligned dual damascene process and structure with low parasitic capacitance | Shau-Lin Shue | 2000-10-17 |
| 5668054 | Process for fabricating tantalum nitride diffusion barrier for copper matallization | Shi-Chung Sun, Hien-Tien Chiu | 1997-09-16 |