HC

Hien-Tien Chiu

TSMC: 2 patents #6,667 of 12,232Top 55%
UM United Microelectronics: 1 patents #2,686 of 4,560Top 60%
Overall (All Time): #1,614,780 of 4,157,543Top 40%
3
Patents All Time

Issued Patents All Time

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
6359160 MOCVD molybdenum nitride diffusion barrier for CU metallization Shi-Chung Sun 2002-03-19
6114242 MOCVD molybdenum nitride diffusion barrier for Cu metallization Shi-Chung Sun 2000-09-05
5668054 Process for fabricating tantalum nitride diffusion barrier for copper matallization Shi-Chung Sun, Ming-Hsing Tsai 1997-09-16