Issued Patents All Time
Showing 126–150 of 181 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9892946 | Processing apparatus and method | Kai-Fang Cheng, Shao-Kuan Lee | 2018-02-13 |
| 9881871 | Schemes for forming barrier layers for copper in interconnect structures | Chen-Hua Yu, Tien-I Bao | 2018-01-30 |
| 9859154 | Structure and formation method of interconnect structure of semiconductor device | Shao-Kuan Lee, Hsin-Yen Huang | 2018-01-02 |
| 9859152 | Protecting layer in a semiconductor structure | Chi-Lin Teng, Tien-I Bao | 2018-01-02 |
| 9852915 | Etching apparatus | Wan-Yu Lee, Ying-Hao Kuo, Tien-I Bao | 2017-12-26 |
| 9831090 | Method and structure for semiconductor device having gate spacer protection layer | Chih Wei Lu, Chung-Ju Lee, Chien-Hua Huang, Tien-I Bao | 2017-11-28 |
| 9818690 | Self-aligned interconnection structure and method | Jung-Hsun Tsai, Chi-Lin Teng, Kai-Fang Cheng, Hsin-Yen Huang, Tien-I Bao +1 more | 2017-11-14 |
| 9799603 | Semiconductor device structure and method for forming the same | Kai-Fang Cheng, Chi-Lin Teng, Hsin-Yen Huang, Tien-I Bao, Jung-Hsun Tsai | 2017-10-24 |
| 9773676 | Lithography using high selectivity spacers for pitch reduction | Yu-Sheng Chang, Cheng-Hsiung Tsai, Chung-Ju Lee, Hsiang-Huan Lee, Ming-Feng Shieh +5 more | 2017-09-26 |
| 9709905 | System and method for dark field inspection | Bo-Jiun Lin, Hsin-Chieh Yao, Tien-I Bao | 2017-07-18 |
| 9659864 | Method and apparatus for forming self-aligned via with selectively deposited etching stop layer | Yung-Hsu Wu, Jung-Hsun Tsai, Shau-Lin Shue, Tien-I Bao | 2017-05-23 |
| 9651736 | Self-alignment due to wettability difference of an interface | Jay Lai, Ying-Hao Kuo, Tien-I Bao | 2017-05-16 |
| 9568677 | Waveguide structure and method for fabricating the same | Chun-Hao Tseng, Ying-Hao Kuo, Tien-I Bao | 2017-02-14 |
| 9564397 | Interconnect structure and method of forming the same | Cheng-Hsiung Tsai, Chung-Ju Lee, Shau-Lin Shue, Tien-I Bao | 2017-02-07 |
| 9548241 | Semiconductor device metallization systems and methods | Hsiang-Huan Lee, Shau-Lin Shue, Keith Kuang-Kuo Koai, Tung-Ching Tseng, Wen-Cheng Yang +3 more | 2017-01-17 |
| 9490133 | Etching apparatus | Wan-Yu Lee, Ying-Hao Kuo, Tien-I Bao | 2016-11-08 |
| 9490148 | Adhesion promoter apparatus and method | Chun-Hao Tseng, Ying-Hao Kuo, Kai-Feng Cheng, Tien-I Bao | 2016-11-08 |
| 9484211 | Etchant and etching process | Wan-Yu Lee, Ying-Hao Kuo, Tien-I Bao | 2016-11-01 |
| 9478939 | Light coupling device and methods of forming same | Jui Hsieh Lai, Ying-Hao Kuo, Tien-I Bao | 2016-10-25 |
| 9460988 | Interconnect structures | Chen-Hua Yu, Tien-I Bao | 2016-10-04 |
| 9405063 | Integrated metal grating | Jui Hsieh Lai, Tien-I Bao, Ying-Hao Kuo | 2016-08-02 |
| 9373579 | Protecting layer in a semiconductor structure | Chi-Lin Teng, Tien-I Bao | 2016-06-21 |
| 9335473 | Package structure and methods of forming same | Jui Hsieh Lai, Ying-Hao Kuo, Tien-I Bao | 2016-05-10 |
| 9330989 | System and method for chemical-mechanical planarization of a metal layer | Yung-Hsu Wu, Shih-Kang Fu, Hsin-Chieh Yao, Hsiang-Huan Lee, Chung-Ju Lee +1 more | 2016-05-03 |
| 9318364 | Semiconductor device metallization systems and methods | Hsiang-Huan Lee, Shau-Lin Shue, Keith Kuang-Kuo Koai, Tung-Ching Tseng, Wen-Cheng Yang +3 more | 2016-04-19 |