Issued Patents All Time
Showing 76–100 of 181 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450566 | Semiconductor device and manufacturing method thereof | Hsin-Yen Huang, Kai-Fang Cheng, Chi-Lin Teng, Shao-Kuan Lee | 2022-09-20 |
| 11361989 | Method for manufacturing interconnect structures including air gaps | Cheng-Chin Lee, Shao-Kuan Lee, Hsin-Yen Huang, Shau-Lin Shue | 2022-06-14 |
| 11355390 | Interconnect strucutre with protective etch-stop | Shao-Kuan Lee, Hsin-Yen Huang, Shau-Lin Shue, Cheng-Chin Lee | 2022-06-07 |
| 11355430 | Capping layer overlying dielectric structure to increase reliability | Ting-Ya Lo, Chi-Lin Teng, Hsin-Yen Huang, Shau-Lin Shue, Shao-Kuan Lee +1 more | 2022-06-07 |
| 11335596 | Selective deposition for integrated circuit interconnect structures | Hsin-Yen Huang, Shao-Kuan Lee, Cheng-Chin Lee, Shau-Lin Shue | 2022-05-17 |
| 11328991 | Semiconductor structure and method making the same | Hsin-Yen Huang, Kai-Fang Cheng, Chi-Lin Teng, Tien-I Bao | 2022-05-10 |
| 11322395 | Dielectric capping structure overlying a conductive structure to increase stability | Hsin-Yen Huang, Chi-Lin Teng, Shau-Lin Shue, Shao-Kuan Lee, Cheng-Chin Lee +1 more | 2022-05-03 |
| 11315828 | Metal oxide composite as etch stop layer | Kai-Fang Cheng, Chi-Lin Teng, Hsin-Yen Huang | 2022-04-26 |
| 11302798 | Semiconductor devices with air gate spacer and air gate cap | Cheng-Chi Chuang, Lin-Yu Huang, Chia-Hao Chang, Yu-Ming Lin, Ting-Ya Lo +2 more | 2022-04-12 |
| 11251073 | Selective deposition of barrier layer | Hsin-Yen Huang, Shau-Lin Shue | 2022-02-15 |
| 11227833 | Interconnect structure and method for forming the same | Shao-Kuan Lee, Cheng-Chin Lee, Hsin-Yen Huang, Shau-Lin Shue | 2022-01-18 |
| 11222843 | Interconnect structure and method for forming the same | Hsin-Yen Huang, Shao-Kuan Lee, Cheng-Chin Lee, Shau-Lin Shue | 2022-01-11 |
| 11189560 | Semiconductor device comprising etch stop layer over dielectric layer and method of manufacture | Shao-Kuan Lee, Hsin-Yen Huang, Shau-Lin Shue, Cheng-Chin Lee | 2021-11-30 |
| 11125940 | Method of fabrication polymer waveguide | Chun-Hao Tseng, Wan-Yu Lee, Tien-I Bao | 2021-09-21 |
| 11081447 | Graphene-assisted low-resistance interconnect structures and methods of formation thereof | Shin-Yi Yang, Yu-Chen Chan, Ming-Han Lee, Shau-Lin Shue | 2021-08-03 |
| 11075113 | Metal capping layer and methods thereof | Shao-Kuan Lee, Cheng-Chin Lee, Hsin-Yen Huang, Shau-Lin Shue | 2021-07-27 |
| 11069526 | Using a self-assembly layer to facilitate selective formation of an etching stop layer | Shao-Kuan Lee, Hsin-Yen Huang, Yung-Hsu Wu, Cheng-Chin Lee, Shau-Lin Shue | 2021-07-20 |
| 11049811 | Forming interlayer dielectric material by spin-on metal oxide deposition | Chi-Lin Teng, Jung-Hsun Tsai, Kai-Fang Cheng, Hsin-Yen Huang, Tien-I Bao | 2021-06-29 |
| 11004740 | Structure and method for interconnection with self-alignment | Tai-I Yang, Yu-Chieh Liao, Chia-Tien Wu, Hsin-Ping Chen, Shau-Lin Shue | 2021-05-11 |
| 10983278 | Adhesion promoter apparatus and method | Chun-Hao Tseng, Ying-Hao Kuo, Kai-Fang Cheng, Tien-I Bao | 2021-04-20 |
| 10943867 | Schemes for forming barrier layers for copper in interconnect structures | Chen-Hua Yu, Tien-I Bao | 2021-03-09 |
| 10930551 | Methods for fabricating a low-resistance interconnect | Hsin-Yen Huang, Shao-Kuan Lee, Cheng-Chin Lee, Hsiang-Wei Liu, Tai-I Yang +2 more | 2021-02-23 |
| 10867913 | Method and apparatus for forming self-aligned via with selectively deposited etching stop layer | Yung-Hsu Wu, Jung-Hsun Tsai, Shau-Lin Shue, Tien-I Bao | 2020-12-15 |
| 10867922 | Porogen bonded gap filling material in semiconductor manufacturing | Bo-Jiun Lin, Ching-Yu Chang, Tien-I Bao | 2020-12-15 |
| 10867843 | Method and system for fabrication semiconductor device | Shao-Kuan Lee, Hsin-Yen Huang | 2020-12-15 |