Issued Patents All Time
Showing 151–175 of 181 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9281263 | Interconnect structure including a continuous conductive body | Ming-Han Lee, Hsiang-Huan Lee, Tien-I Bao, Chi-Lin Teng | 2016-03-08 |
| 9275953 | Semiconductor integrated circuit and fabricating the same | Hsin-Yen Huang, Yu-Sheng Chang, Tien-I Bao | 2016-03-01 |
| 9230911 | Interconnect structure and method of forming the same | Cheng-Hsiung Tsai, Chung-Ju Lee, Tien-I Bao, Shau-Lin Shue | 2016-01-05 |
| 9224643 | Structure and method for tunable interconnect scheme | Chung-Ju Lee, Tien-I Bao, Ming-Shih Yeh, Shau-Lin Shue | 2015-12-29 |
| 9177797 | Lithography using high selectivity spacers for pitch reduction | Yu-Sheng Chang, Chung-Ju Lee, Cheng-Hsiung Tsai, Yung-Hsu Wu, Hsiang-Huan Lee +5 more | 2015-11-03 |
| 9165822 | Semiconductor devices and methods of forming same | Hsin-Yen Huang, Chi-Lin Teng, Tien-I Bao | 2015-10-20 |
| 9134633 | System and method for dark field inspection | Bo-Jiun Lin, Hsin-Chieh Yao, Tien-I Bao | 2015-09-15 |
| 9129968 | Schemes for forming barrier layers for copper in interconnect structures | Chen-Hua Yu, Tien-I Bao | 2015-09-08 |
| 9041015 | Package structure and methods of forming same | Jui Hsieh Lai, Ying-Hao Kuo, Tien-I Bao | 2015-05-26 |
| 9036956 | Method of fabricating a polymer waveguide | Chun-Hao Tseng, Wan-Yu Lee, Tien-I Bao | 2015-05-19 |
| 8976833 | Light coupling device and methods of forming same | Jui Hsieh Lai, Ying-Hao Kuo, Tien-I Bao | 2015-03-10 |
| 8922900 | Optical element structure and optical element fabricating process for the same | Chun-Hao Tseng, Ying-Hao Kuo, Tien-I Bao | 2014-12-30 |
| 8847396 | Semiconductor integrated circuit and fabricating the same | Hsin-Yen Huang, Yu-Sheng Chang, Tien-I Bao | 2014-09-30 |
| 8836127 | Interconnect with flexible dielectric layer | Ching-Yu Lo, Bo-Jiun Lin, Tien-I Bao, Shau-Lin Shue, Chen-Hua Yu | 2014-09-16 |
| 8828484 | Self-alignment due to wettability difference of an interface | Jay Lai, Ying-Hao Kuo, Tien-I Bao | 2014-09-09 |
| 8735278 | Copper etch scheme for copper interconnect structure | Ming-Han Lee, Hsiang-Huan Lee, Tien-I Bao, Chi-Lin Teng | 2014-05-27 |
| 8736014 | High mechanical strength additives for porous ultra low-k material | Bo-Jiun Lin, Ching-Yu Lo, Tien-I Bao, Chen-Hua Yu | 2014-05-27 |
| 8729703 | Schemes for forming barrier layers for copper in interconnect structures | Chen-Hua Yu, Tien-I Bao | 2014-05-20 |
| 8629066 | Liner formation in 3DIC structures | Ching-Yu Lo, Hung-Jung Tu, Tien-I Bao, Wen-Chih Chiou, Chen-Hua Yu | 2014-01-14 |
| 8446012 | Interconnect structures | Chen-Hua Yu, Tien-I Bao | 2013-05-21 |
| 8440564 | Schemes for forming barrier layers for copper in interconnect structures | Chen-Hua Yu, Tien-I Bao | 2013-05-14 |
| 8405192 | Low dielectric constant material | Hsin-Yen Huang, Ching-Yu Lo, Tien-I Bao | 2013-03-26 |
| 8264066 | Liner formation in 3DIC structures | Ching-Yu Lo, Hung-Jung Tu, Tien-I Bao, Wen-Chih Chiou, Chen-Hua Yu | 2012-09-11 |
| 8232201 | Schemes for forming barrier layers for copper in interconnect structures | Chen-Hua Yu, Tien-I Bao | 2012-07-31 |
| 7964496 | Schemes for forming barrier layers for copper in interconnect structures | Chen-Hua Yu, Tien-I Bao | 2011-06-21 |