Issued Patents All Time
Showing 76–100 of 136 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10092768 | Interconnect structure and method of forming same | Shu-Ting Tsai, Jeng-Shyan Lin, Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu | 2018-10-09 |
| 10090353 | Semiconductor devices, methods of manufacturing thereof, and image sensor devices | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Min-Feng Kao | 2018-10-02 |
| 10062728 | Image sensor device and method | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Shuang-Ji Tsai | 2018-08-28 |
| 10038026 | Bond pad structure for bonding improvement | Sin-Yao Huang, Ching-Chun Wang, Dun-Nian Yaung, Ming-Tsong Wang, Shih Pei Chou | 2018-07-31 |
| 10038025 | Via support structure under pad areas for BSI bondability improvement | Sin-Yao Huang, Ching-Chun Wang, Dun-Nian Yaung | 2018-07-31 |
| 10014340 | Stacked SPAD image sensor | Ming-Hsien Yang, Ching-Chun Wang, Dun-Nian Yaung, Shyh-Fann Ting, Chun-Yuan Chen | 2018-07-03 |
| 10008531 | Varied STI liners for isolation structures in image sensing devices | Cheng-Hsien Chou, Chia-Shiung Tsai, Jiech-Fun Lu, Min-Feng Kao, Shih Pei Chou +1 more | 2018-06-26 |
| 9941249 | Multi-wafer stacking by Ox-Ox bonding | Shu-Ting Tsai, Szu-Ying Chen, Jeng-Shyan Lin, Tzu-Hsuan Hsu, Dun-Nian Yaung | 2018-04-10 |
| 9905426 | Gate electrodes with notches and methods for forming the same | Min-Feng Kao, Szu-Ying Chen, Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu | 2018-02-27 |
| 9905605 | Phase detection autofocus techniques | Wen-I Hsu, Dun-Nian Yaung, Keng-Yu Chou | 2018-02-27 |
| 9887182 | 3DIC structure and method for hybrid bonding semiconductor wafers | Ju-Shi Chen, Cheng-Ying Ho, Chun-Chieh Chuang, Sheng-Chau Chen, Shih Pei Chou +4 more | 2018-02-06 |
| 9881884 | Semiconductor device structure and method for forming the same | Ming-Hsien Yang, Ching-Chun Wang, Dun-Nian Yaung, Sin-Yao Huang | 2018-01-30 |
| 9871070 | Voltage biased metal shielding and deep trench isolation for backside illuminated (BSI) image sensors | Tzu-Hsuan Hsu, Ching-Chun Wang, Chien-Hsien Tseng, Chen-Jong Wang, Wen-I Hsu | 2018-01-16 |
| 9865645 | Interconnect structure for stacked device and method | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Shu-Ting Tsai +1 more | 2018-01-09 |
| 9865630 | Image sensor pickup region layout | Dun-Nian Yaung, Ching-Chun Wang, Jeng-Shyan Lin, Yan-Chih Lu | 2018-01-09 |
| 9847368 | Vertically integrated image sensor chips and methods for forming the same | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Szu-Ying Chen, Wen-De Wang +1 more | 2017-12-19 |
| 9812487 | Structure and method for 3D image sensor | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Shuang-Ji Tsai +3 more | 2017-11-07 |
| 9780137 | Mechanisms for forming image-sensor device with epitaxial isolation feature | Wen-I Hsu, Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu | 2017-10-03 |
| 9764153 | Interconnect structure and method of forming same | Shu-Ting Tsai, Jeng-Shyan Lin, Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu | 2017-09-19 |
| 9761629 | Image sensor device and method | Dun-Nian Yaung, Jen-Cheng Liu, Jeng-Shyan Lin, Shuang-Ji Tsai | 2017-09-12 |
| 9728521 | Hybrid bond using a copper alloy for yield improvement | Yu-Cheng Tsai, Chun-Chieh Chuang, Ching-Chun Wang, Dun-Nian Yaung, Chih-Hui Huang +2 more | 2017-08-08 |
| 9711548 | Methods of manufacturing semiconductor devices | Jhy-Jyi Sze, Shou-Gwo Wuu | 2017-07-18 |
| 9704827 | Hybrid bond pad structure | Sin-Yao Huang, Chun-Chieh Chuang, Ching-Chun Wang, Sheng-Chau Chen, Dun-Nian Yaung +1 more | 2017-07-11 |
| 9666630 | Semiconductor devices, methods of manufacturing thereof, and image sensor devices | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Min-Feng Kao | 2017-05-30 |
| 9666624 | Mechanisms for forming image-sensor device with deep-trench isolation structure | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu | 2017-05-30 |