Issued Patents All Time
Showing 26–50 of 136 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11437420 | Image sensor with overlap of backside trench isolation structure and vertical transfer gate | Dun-Nian Yaung, Jen-Cheng Liu, Wei Chuang Wu, Yen-Yu Chen, Chih-Kuan Yu | 2022-09-06 |
| 11342374 | Mechanisms for forming image-sensor device with deep-trench isolation structure | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu | 2022-05-24 |
| 11342373 | Manufacturing method of image sensing device | Wei Chuang Wu, Ming-Tsong Wang, Ching-Chun Wang, Jen-Cheng Liu, Dun-Nian Yaung | 2022-05-24 |
| 11335716 | Photosensing pixel, image sensor and method of fabricating the same | Sin-Yao Huang, Chen-Hsien Lin, Tzu-Hsuan Hsu, Yan-Chih Lu | 2022-05-17 |
| 11282802 | Semiconductor device structure and method for forming the same | Ming-Hsien Yang, Ching-Chun Wang, Dun-Nian Yaung, Sin-Yao Huang | 2022-03-22 |
| 11244981 | Bond pad structure for bonding improvement | Sin-Yao Huang, Ching-Chun Wang, Dun-Nian Yaung, Ming-Tsong Wang, Shih Pei Chou | 2022-02-08 |
| 11211419 | Composite bsi structure and method of manufacturing the same | Wei Chuang Wu, Dun-Nian Yaung, Jen-Cheng Liu, Jhy-Jyi Sze, Keng-Yu Chou +3 more | 2021-12-28 |
| 11088192 | Metal block and bond pad structure | Cheng-Ying Ho, Ching-Chun Wang, Dun-Nian Yaung, Yan-Chih Lu | 2021-08-10 |
| 11069736 | Via support structure under pad areas for BSI bondability improvement | Sin-Yao Huang, Ching-Chun Wang, Dun-Nian Yaung | 2021-07-20 |
| 11024602 | Hybrid bond pad structure | Sin-Yao Huang, Chun-Chieh Chuang, Ching-Chun Wang, Sheng-Chau Chen, Dun-Nian Yaung +1 more | 2021-06-01 |
| 11011567 | Structure and method for 3D image sensor | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Shuang-Ji Tsai +3 more | 2021-05-18 |
| 11004880 | Semiconductor imaging device having improved dark current performance | Seiji Takahashi, Chen-Jong Wang, Dun-Nian Yaung, Feng-Jia Shiu, Jen-Cheng Liu +5 more | 2021-05-11 |
| 10991752 | Vertically integrated image sensor chips and methods for forming the same | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Szu-Ying Chen, Wen-De Wang +1 more | 2021-04-27 |
| 10978345 | Interconnect structure for stacked device | Shu-Ting Tsai, Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Chih-Hui Huang +3 more | 2021-04-13 |
| 10886320 | Mechanisms for forming image-sensor device with epitaxial isolation feature | Wen-I Hsu, Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu | 2021-01-05 |
| 10861899 | Interconnect structure for stacked device and method | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Shu-Ting Tsai +1 more | 2020-12-08 |
| 10861894 | Multiple deep trench isolation (MDTI) structure for CMOS image sensor | Wei Chuang Wu, Ching-Chun Wang, Dun-Nian Yaung, Jen-Cheng Liu, Yen-Ting Chiang +2 more | 2020-12-08 |
| 10797091 | Semiconductor imaging device having improved dark current performance | Seiji Takahashi, Chen-Jong Wang, Dun-Nian Yaung, Feng-Jia Shiu, Jen-Cheng Liu +5 more | 2020-10-06 |
| 10763292 | Interconnect apparatus and method for a stacked semiconductor device | Jeng-Shyan Lin, Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Shih Pei Chou +2 more | 2020-09-01 |
| 10734428 | Image sensor device | Szu-Ying Chen, Min-Feng Kao, Jen-Cheng Liu, Dun-Nian Yaung | 2020-08-04 |
| 10727265 | Multiple deep trench isolation (MDTI) structure for CMOS image sensor | Wei Chuang Wu, Ching-Chun Wang, Dun-Nian Yaung, Jen-Cheng Liu, Yen-Ting Chiang +2 more | 2020-07-28 |
| 10682523 | Interconnect structure and method of forming same | Shu-Ting Tsai, Jeng-Shyan Lin, Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu | 2020-06-16 |
| 10672819 | Mechanisms for forming image-sensor device with deep-trench isolation structure | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu | 2020-06-02 |
| 10629568 | Stacked integrated circuits with redistribution lines | Cheng-Ying Ho, Jeng-Shyan Lin, Wen-I Hsu, Dun-Nian Yaung, Ying-Ling Tsai | 2020-04-21 |
| 10622394 | Image sensing device | Wei Chuang Wu, Ming-Tsong Wang, Ching-Chun Wang, Jen-Cheng Liu, Dun-Nian Yaung | 2020-04-14 |