Issued Patents All Time
Showing 76–100 of 117 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9412648 | Via patterning using multiple photo multiple etch | Jung-Hau Shiu, Tze-Liang Lee, Wen-Kuo Hsieh, Yu-Yun Peng | 2016-08-09 |
| 9324606 | Self-aligned repairing process for barrier layer | Chih-Chien Chi, Mei-Ling Chen, Huang-Yi Huang, Szu-Ping Tung, Ching-Hua Hsieh | 2016-04-26 |
| 9236294 | Method for forming semiconductor device structure | Chia-Cheng Chou, Po-Cheng Shih, Chih-Hung Sun, Kuang-Yuan Hsu, Joung-Wei Liou +1 more | 2016-01-12 |
| 9196551 | Automatically adjusting baking process for low-k dielectric material | Chia-Cheng Chou, Keng-Chu Lin, Shwang-Ming Jeng | 2015-11-24 |
| 9153538 | Semiconductor devices and methods of manufacture thereof | Pei-Wen Huang, Chih-Hao Chen, Kuang-Yuan Hsu, Tze-Liang Lee | 2015-10-06 |
| 9136226 | Impurity doped UV protection layer | Zhen-Cheng Wu, Yung-Cheng Lu | 2015-09-15 |
| 9130017 | Methods for forming interconnect structures of integrated circuits | Po-Cheng Shih, Keng-Chu Lin | 2015-09-08 |
| 9093265 | High UV curing efficiency for low-k dielectrics | Po-Cheng Shih, Hui-Chun Yang, Kuang-Yuan Hsu | 2015-07-28 |
| 9087877 | Low-k interconnect structures with reduced RC delay | Ting-Yu Shen, Keng-Chu Lin, Chia-Cheng Chou, Tien-I Bao, Shwang-Ming Jeng +1 more | 2015-07-21 |
| 9004914 | Method of and apparatus for active energy assist baking | Chia-Cheng Chou, Keng-Chu Lin, Joung-Wei Liou, Shwang-Ming Jeng, Mei-Ling Chen | 2015-04-14 |
| 8993435 | Low-k Cu barriers in damascene interconnect structures | Kuan-Chen Wang, Po-Cheng Shih, Keng-Chu Lin, Shwang-Ming Jeng | 2015-03-31 |
| 8940643 | Double patterning strategy for contact hole and trench in photolithography | Chih-Hao Chen, Keng-Chu Lin | 2015-01-27 |
| 8846528 | Method of modifying a low k dielectric layer having etched features and the resulting product | Joung-Wei Liou, Chia-Cheng Chou, Keng-Chu Lin | 2014-09-30 |
| 8629056 | Method for forming self-assembled mono-layer liner for cu/porous low-k interconnections | Chia-Cheng Chou, Keng-Chu Lin, Tien-I Bao, Chen-Hua Yu | 2014-01-14 |
| 8536064 | Double patterning strategy for contact hole and trench in photolithography | Chih-Hao Chen, Keng-Chu Lin | 2013-09-17 |
| 8481412 | Method of and apparatus for active energy assist baking | Chia-Cheng Chou, Keng-Chu Lin, Joung-Wei Liou, Shwang-Ming Jeng, Mei-Ling Chen | 2013-07-09 |
| 8470708 | Double patterning strategy for contact hole and trench in photolithography | Po-Cheng Shih, Kuan-Chen Wang, Keng-Chu Lin, Tai-Yen Peng, Wen-Kuo Hsieh +1 more | 2013-06-25 |
| 8361900 | Barrier layer for copper interconnect | Shing-Chyang Pan, Han-Hsin Kuo, Ching-Hua Hsieh | 2013-01-29 |
| 8158521 | Two step post-deposition treatment of ILD layer for a lower dielectric constant and improved mechanical properties | Hui-Lin Chang, Tien-I Bao, Yun-Chen Lu | 2012-04-17 |
| 8105947 | Post etch dielectric film re-capping layer | Shwang-Ming Jeng, Kin-Weng Wang, Hsin-Yi Tsai, Keng-Chu Lin | 2012-01-31 |
| 7968451 | Method for forming self-assembled mono-layer liner for Cu/porous low-k interconnections | Chia-Cheng Chou, Keng-Chu Lin, Tien-I Bao, Chen-Hua Yu | 2011-06-28 |
| 7897505 | Method for enhancing adhesion between layers in BEOL fabrication | Lih-Ping Li, Yung-Cheng Lu, Hui-Lin Chang, Chih-Hsien Lin | 2011-03-01 |
| 7732923 | Impurity doped UV protection layer | Zhen-Cheng Wu, Yung-Cheng Lu | 2010-06-08 |
| 7723226 | Interconnects containing bilayer porous low-k dielectrics using different porogen to structure former ratio | Chen-Hua Yu, Yung-Cheng Lu, Pei-Ren Jeng, Chia-Cheng Chou, Keng-Chu Lin +2 more | 2010-05-25 |
| 7598176 | Method for photoresist stripping and treatment of low-k dielectric material | Jang-Shiang Tsai, Yi-Nien Su, Jyu-Horng Shieh, Peng-Fu Hsu, Hun-Jan Tao | 2009-10-06 |