Issued Patents All Time
Showing 76–100 of 186 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10087071 | Semiconductor structure and manufacturing method thereof | Tzu-Heng Wu, Yi Heng Tsai, Cheng San Chou, Chen-Hsiung Yang | 2018-10-02 |
| 10071905 | Micro-electro mechanical system (MEMS) structures with through substrate vias and methods of forming the same | Kuei-Sung Chang, Te-Hao Lee | 2018-09-11 |
| 10065852 | MEMS device and manufacturing method thereof | Chun-Wen Cheng, MING-DAO WU, Tzu-Heng Wu | 2018-09-04 |
| 10046965 | CMOS-MEMS structure and method of forming the same | Jung-Huei Peng, Fei-Lung Lai, Shiang-Chi Lin | 2018-08-14 |
| 10035700 | Semiconductor structure and manufacturing method thereof | Chun-Wen Cheng, Fei-Lung Lai, Shiang-Chi Lin | 2018-07-31 |
| 10017382 | MEMS integrated pressure sensor devices and methods of forming same | Chun-Wen Cheng | 2018-07-10 |
| 10017378 | MEMS pressure sensor and microphone devices having through-vias and methods of forming same | Chun-Wen Cheng | 2018-07-10 |
| 9998843 | Method for manufacturing a microphone | Jung-Huei Peng, Chun-Wen Cheng, Chin-Yi Cho, Li-Min Hung, Yao-Te Huang | 2018-06-12 |
| 9981841 | MEMS integrated pressure sensor and microphone devices and methods of forming same | Chun-Wen Cheng | 2018-05-29 |
| 9975762 | Stacked semiconductor structure and method of forming the same | Chun-Wen Cheng | 2018-05-22 |
| 9938138 | MEMS device structure with a capping structure | Chun-Wen Cheng | 2018-04-10 |
| 9933388 | Integrated biosensor | Chun-Wen Cheng, Fei-Lung Lai, Yi-Hsien Chang, Hsin-Chieh Huang | 2018-04-03 |
| 9910009 | CMOS compatible BioFET | Alexander Kalnitsky, Yi-Shao Liu, Kai-Chih Liang, Chun-Ren Cheng, Chun-Wen Cheng | 2018-03-06 |
| 9873610 | Multiple bonding in wafer level packaging | Chung-Hsien Lin, Li-Cheng Chu, Yuan-Chih Hsieh, Chun-Wen Cheng | 2018-01-23 |
| 9868628 | Method and structure for CMOS-MEMS thin film encapsulation | Yu-Chia Liu, Chun-Wen Cheng | 2018-01-16 |
| 9859819 | MEMS structure and method of forming same | Yi Heng Tsai, Kuei-Sung Chang | 2018-01-02 |
| 9850125 | MEMS integrated pressure sensor devices having isotropic cavitites and methods of forming same | Chun-Wen Cheng | 2017-12-26 |
| 9822000 | MEMS and CMOS integration with low-temperature bonding | Chun-Wen Cheng, Jung-Huei Peng | 2017-11-21 |
| 9796582 | Method for integrating complementary metal-oxide-semiconductor (CMOS) devices with microelectromechanical systems (MEMS) devices using a flat surface above a sacrificial layer | Chun-Wen Cheng | 2017-10-24 |
| 9791406 | CMOS compatible BioFET | Alexander Kalnitsky, Yi-Shao Liu, Kai-Chih Liang, Chun-Ren Cheng, Chun-Wen Cheng | 2017-10-17 |
| 9776856 | Vacuum sealed MEMS and CMOS package | Chun-Wen Cheng, Yi-Chuan Teng, Hung-Chia Tsai | 2017-10-03 |
| 9725301 | Structures and formation methods of micro-electro mechanical system device | Chun-Wen Cheng, Shang-Ying Tsai, Chin-Wei Liang | 2017-08-08 |
| 9718669 | MEMS pressure sensor and method of manufacturing the same | Tung-Tsun Chen | 2017-08-01 |
| 9695039 | Multi-pressure MEMS package | Yu-Chia Liu, Chun-Wen Cheng, Kuei-Sung Chang, Jung-Huei Peng | 2017-07-04 |
| 9691725 | Integrated semiconductor device and wafer level method of fabricating the same | Kuei-Sung Chang, Chun-Wen Cheng, Alexander Kalnitsky | 2017-06-27 |