Issued Patents All Time
Showing 126–150 of 186 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9450109 | MEMS devices and fabrication methods thereof | Chun-Wen Cheng, Te-Hao Lee, Chung-Hsien Lin | 2016-09-20 |
| 9403673 | Method for manufacturing a microelectromechanical systems (MEMS) device with different electrical potentials and an etch stop | Yu-Chia Liu, Kuei-Sung Chang, Chun-Wen Cheng | 2016-08-02 |
| 9394161 | MEMS and CMOS integration with low-temperature bonding | Chun-Wen Cheng, Jung-Huei Peng | 2016-07-19 |
| 9388040 | Stacked semiconductor device and method of forming the same related cases | Chun-Wen Cheng | 2016-07-12 |
| 9386380 | Method for the integration of a microelectromechanical systems (MEMS) microphone device with a complementary metal-oxide-semiconductor (CMOS) device | Chun-Wen Cheng | 2016-07-05 |
| 9337182 | Method to integrate different function devices fabricated by different process technologies | Kuei-Sung Chang, Chun-Wen Cheng, Alex Kalnitsky | 2016-05-10 |
| 9337168 | Hermetic wafer level packaging | Richard Chu, Martin Liu, Yuan-Chih Hsieh, Chung-Hsien Lin, Lan-Lin Chao +2 more | 2016-05-10 |
| 9309109 | MEMS-CMOS integrated devices, and methods of integration at wafer level | Chun-Wen Cheng | 2016-04-12 |
| 9290376 | MEMS packaging techniques | Chun-Wen Cheng, Chien-Hsuan Tai | 2016-03-22 |
| 9293431 | Integrated semiconductor device and wafer level method of fabricating the same | Kuei-Sung Chang, Chun-Wen Cheng, Alexander Kalnitsky | 2016-03-22 |
| 9260295 | MEMS integrated pressure sensor devices having isotropic cavities and methods of forming same | Chun-Wen Cheng | 2016-02-16 |
| 9260296 | MEMS integrated pressure sensor devices and methods of forming same | Chun-Wen Cheng | 2016-02-16 |
| 9264833 | Structure and method for integrated microphone | Jung-Huei Peng, Yao-Te Huang, Chin-Yi Cho, Li-Min Hung, Chun-Wen Cheng | 2016-02-16 |
| 9254997 | CMOS-MEMS integrated flow for making a pressure sensitive transducer | Chun-Wen Cheng, Kai-Chih Liang | 2016-02-09 |
| 9238578 | Semiconductor arrangement with stress release and thermal insulation | Chun-Wen Cheng, Yi-Chuan Teng | 2016-01-19 |
| 9233839 | MEMS device and method of forming the same | Yu-Chia Liu, Jung-Huei Peng, Kuei-Sung Chang, Chun-Wen Cheng | 2016-01-12 |
| 9221674 | Method for manufacturing a microelectromechanical systems (MEMS) device with different electrical potentials and an etch stop | Yu-Chia Liu, Kuei-Sung Chang, Chun-Wen Cheng | 2015-12-29 |
| 9187317 | MEMS integrated pressure sensor and microphone devices and methods of forming same | Chun-Wen Cheng | 2015-11-17 |
| 9133017 | MEMS structure with adaptable inter-substrate bond | Kai-Chih Liang, Jiou-Kang Lee, Chung-Hsien Lin, Te-Hao Lee | 2015-09-15 |
| 9130531 | Semiconductor arrangement with thermal insulation configuration | Chun-Wen Cheng, Yi-Chuan Teng | 2015-09-08 |
| 9123547 | Stacked semiconductor device and method of forming the same | Chun-Wen Cheng | 2015-09-01 |
| 9114976 | Semiconductor arrangement with stress release configuration | Chun-Wen Cheng, Yi-Chuan Teng | 2015-08-25 |
| 9096420 | Methods and apparatus for MEMS devices with increased sensitivity | Chun-Wen Cheng | 2015-08-04 |
| 9085455 | MEMS devices and methods for forming same | Chun-Wen Cheng | 2015-07-21 |
| 9079761 | Stacked semiconductor device and method of forming the same related cases | Chun-Wen Cheng | 2015-07-14 |