Issued Patents All Time
Showing 151–175 of 186 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9065358 | MEMS structure and method of forming same | Yi Heng Tsai, Kuei-Sung Chang | 2015-06-23 |
| 9040334 | MEMS integrated pressure sensor devices and methods of forming same | Chun-Wen Cheng | 2015-05-26 |
| 9035451 | Wafer level sealing methods with different vacuum levels for MEMS sensors | Yu-Chia Liu, Kuei-Sung Chang, Chun-Wen Cheng | 2015-05-19 |
| 9029961 | Wafer level method of sealing different pressure levels for MEMS sensors | Kuei-Sung Chang, Yu-Chia Liu | 2015-05-12 |
| 9006015 | Dual layer microelectromechanical systems device and method of manufacturing same | Te-Hao Lee, Jiou-Kang Lee, Kai-Chih Liang, Chung-Hsien Lin, Chun-Wen Cheng | 2015-04-14 |
| 8987059 | MEMS devices and methods of forming same | Kai-Chih Liang, Te-Hao Lee, Jiou-Kang Lee, Chung-Hsien Lin | 2015-03-24 |
| 8962367 | MEMS device with release aperture | Chung-Hsien Lin, Chun-Wen Cheng | 2015-02-24 |
| 8900905 | MEMS device and method of forming the same | Yu-Chia Liu, Jung-Huei Peng, Kuei-Sung Chang, Chun-Wen Cheng | 2014-12-02 |
| 8895360 | Integrated semiconductor device and wafer level method of fabricating the same | Kuei-Sung Chang, Chun-Wen Cheng, Alex Kalnitsky | 2014-11-25 |
| 8846416 | Method for forming biochips and biochips with non-organic landings for improved thermal budget | Allen Timothy Chang, Ching-Ray Chen, Yi-Hsien Chang, Yi-Shao Liu, Chun-Ren Cheng +1 more | 2014-09-30 |
| 8802473 | MEMS integrated pressure sensor devices having isotropic cavities and methods of forming same | Chun-Wen Cheng | 2014-08-12 |
| 8797127 | MEMS switch with reduced dielectric charging effect | Chung-Hsien Lin, Chun-Wen Cheng | 2014-08-05 |
| 8763220 | Method of manufacturing a MEMS device | Tien-Kan Chung, Chung-Hsien Lin, Yao-Te Huang, Chia-Ming Hung, Wen-Chuan Tai +1 more | 2014-07-01 |
| 8748205 | MEMS structure with adaptable inter-substrate bond | Kai-Chih Liang, Jiou-Kang Lee, Chung-Hsien Lin, Te-Hao Lee | 2014-06-10 |
| 8729646 | MEMS devices and methods for forming the same | Chun-Wen Cheng, Te-Hao Lee, Chung-Hsien Lin | 2014-05-20 |
| 8722537 | Multi-sacrificial layer and method | Yao-Te Huang, Yu-Nu Hsu, Chun-Wen Cheng, Li-Chung Peng | 2014-05-13 |
| 8723123 | Light detector with Ge film | Alexander Kalnitsky, Fei-Lung Lai, Chun-Wen Cheng, Chun-Ren Cheng, Yi-Hsien Chang | 2014-05-13 |
| 8716051 | MEMS device with release aperture | Chung-Hsien Lin, Chun-Wen Cheng | 2014-05-06 |
| 8709849 | Wafer level packaging | Chun-Wen Cheng, Chung-Hsien Lin | 2014-04-29 |
| 8704317 | Microstructure device with an improved anchor | Chung-Hsien Lin, Chun-Wen Cheng, Yi Heng Tsai | 2014-04-22 |
| 8648468 | Hermetic wafer level packaging | Richard Chu, Martin Liu, Yuan-Chih Hsieh, Chung-Hsien Lin, Lan-Lin Chao +2 more | 2014-02-11 |
| 8633554 | MEMS device etch stop | Yi Heng Tsai, Kai-Chih Liang, Chia-Pao Shu, Li-Cheng Chu, Kuei-Sung Chang +2 more | 2014-01-21 |
| 8629517 | Wafer level packaging | Chun-Wen Cheng, Chung-Hsien Lin | 2014-01-14 |
| 8629516 | Bulk silicon moving member with dimple | Chia-Pao Shu | 2014-01-14 |
| 8573990 | Cover structure | Hsu-Chih Cheng, Bo Luo | 2013-11-05 |