Issued Patents All Time
Showing 176–186 of 186 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8569808 | Temperature stabilitized MEMS | Tung-Tsun Chen, Chung-Hsien Lin, Jui-Cheng Huang | 2013-10-29 |
| 8551798 | Microstructure with an enhanced anchor | Chung-Hsien Lin, Chun-Wen Cheng | 2013-10-08 |
| 8525278 | MEMS device having chip scale packaging | Chung-Hsien Lin | 2013-09-03 |
| 8486744 | Multiple bonding in wafer level packaging | Chung-Hsien Lin, Li-Cheng Chu, Yuan-Chih Hsieh, Chun-Wen Cheng | 2013-07-16 |
| 8466070 | Methods of forming semiconductor structures | Hsing-Fei Chou, Jieh-Jang Chen, Feng-Jia Shiu, Hung-Chang Hsieh | 2013-06-18 |
| 8410665 | MEMS kinetic energy conversion | Tien-Kan Chung, Chung-Hsien Lin, Yao-Te Huang, Chia-Ming Hung, Wen-Chuan Tai +1 more | 2013-04-02 |
| 8368152 | MEMS device etch stop | Yi Heng Tsai, Kai-Chih Liang, Chia-Pao Shu, Li-Cheng Chu, Kuei-Sung Chang +2 more | 2013-02-05 |
| 8343789 | Microstructure device with an improved anchor | Chung-Hsien Lin, Chun-Wen Cheng, Yi Heng Tsai | 2013-01-01 |
| 8338207 | Bulk silicon moving member with dimple | Chia-Pao Shu | 2012-12-25 |
| 8330559 | Wafer level packaging | Chun-Wen Cheng, Chung-Hsien Lin | 2012-12-11 |
| 8232614 | Package systems having a conductive element through a substrate thereof and manufacturing methods of the same | Kuei-Sung Chang, Chung-Hsien Lin, Chia-Ming Hung, Jung-Huei Peng, Yi Heng Tsai +1 more | 2012-07-31 |