Issued Patents All Time
Showing 76–100 of 120 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9064936 | Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP | Yaojian Lin, Seung Wook Yoon | 2015-06-23 |
| 8994185 | Semiconductor device and method of forming vertical interconnect structure with conductive micro via array for 3-D Fo-WLCSP | Yaojian Lin | 2015-03-31 |
| 8962476 | Method of forming RDL wider than contact pad along first axis and narrower than contact pad along second axis | Yaojian Lin, Xia Feng, Jianmin Feng | 2015-02-24 |
| 8907476 | Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation | Yaojian Lin, Jianmin Fang, Xia Feng | 2014-12-09 |
| 8900929 | Semiconductor device and method for forming openings and trenches in insulating layer by first LDA and second LDA for RDL formation | Yaojian Lin, Pandi C. Marimuthu | 2014-12-02 |
| 8878359 | Semiconductor device and method of forming insulating layer around semiconductor die | Yaojian Lin, Jianmin Fang, Xia Feng, Xusheng Bao | 2014-11-04 |
| 8810024 | Semiconductor method and device of forming a fan-out PoP device with PWB vertical interconnect units | Yaojian Lin, Pandi C. Marimuthu, Yu Gu | 2014-08-19 |
| 8796846 | Semiconductor device with a vertical interconnect structure for 3-D FO-WLCSP | Yaojian Lin, Xusheng Bao, Jianmin Fang | 2014-08-05 |
| 8791008 | Semiconductor device and method of forming micro-vias partially through insulating material over bump interconnect conductive layer for stress relief | Yaojian Lin | 2014-07-29 |
| 8786100 | Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die | Yaojian Lin, Jianmin Fang, Xia Feng | 2014-07-22 |
| 8766426 | Integrated circuit packaging system with warpage control and method of manufacture thereof | Hin Hwa Goh, Xusheng Bao, Yung Kuan Hsiao, Rui Huang | 2014-07-01 |
| 8759155 | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief | Yaojian Lin, Pandi C. Marimuthu, Hin Hwa Goh, Yu Gu, Il Kwon Shim +4 more | 2014-06-24 |
| 8648470 | Semiconductor device and method of forming FO-WLCSP with multiple encapsulants | Yaojian Lin, Jose Alvin Caparas, Hin Hwa Goh | 2014-02-11 |
| 8642446 | Semiconductor device and method of forming protective structure around semiconductor die for localized planarization of insulating layer | Yaojian Lin, Xia Feng, Jianmin Fang | 2014-02-04 |
| 8624353 | Semiconductor device and method of forming integrated passive device over semiconductor die with conductive bridge and fan-out redistribution layer | Yaojian Lin, Kai Liu | 2014-01-07 |
| 8610286 | Semiconductor device and method of forming thick encapsulant for stiffness with recesses for stress relief in Fo-WLCSP | Yaojian Lin, Jose Alvin Caparas, Glenn Omandam | 2013-12-17 |
| 8592992 | Semiconductor device and method of forming vertical interconnect structure with conductive micro via array for 3-D Fo-WLCSP | Yaojian Lin | 2013-11-26 |
| 8592311 | Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structures | Yaojian Lin, Haijing Cao, Qing Zhang, Jianmin Fang | 2013-11-26 |
| 8575018 | Semiconductor device and method of forming bump structure with multi-layer UBM around bump formation area | Yaojian Lin, Jianmin Fang, Pandi C. Marimuthu, Rajendra D. Pendse | 2013-11-05 |
| 8501618 | Semiconductor device and method of forming RDL wider than contact pad along first axis and narrower than contact pad along second axis | Yaojian Lin, Xia Feng, Jianmin Fang | 2013-08-06 |
| 8492203 | Semiconductor device and method for forming semiconductor package having build-up interconnect structure over semiconductor die with different CTE insulating layers | Yaojian Lin, Yu Gu, Wei Meng, Chee Siang Ong | 2013-07-23 |
| 8455991 | Integrated circuit packaging system with warpage control and method of manufacture thereof | Yung Kuan Hsiao, Xusheng Bao, Hin Hwa Goh, Rui Huang | 2013-06-04 |
| 8456002 | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief | Yaojian Lin, Pandi C. Marimuthu, Hin Hwa Goh, Yu Gu, Il Kwon Shim +4 more | 2013-06-04 |
| 8445323 | Semiconductor package with semiconductor core structure and method of forming same | Yaojian Lin, Jianmin Fang, Haijing Cao | 2013-05-21 |
| 8445990 | Semiconductor device and method of forming an inductor within interconnect layer vertically separated from semiconductor die | Yaojian Lin, Jianmin Fang | 2013-05-21 |