Issued Patents All Time
Showing 26–50 of 120 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10170385 | Semiconductor device and method of forming stacked vias within interconnect structure for FO-WLCSP | Yaojian Lin, Rui Huang, Yu Gu | 2019-01-01 |
| 10163747 | Semiconductor device and method of controlling warpage in reconstituted wafer | Kian Meng Heng, Hin Hwa Goh, Jose Alvin Caparas, Seng Guan Chow, Yaojian Lin | 2018-12-25 |
| 10163737 | Semiconductor device and method of forming build-up interconnect structures over carrier for testing at interim stages | Yaojian Lin | 2018-12-25 |
| 10163815 | Semiconductor device with dummy metal protective structure around semiconductor die for localized planarization of insulating layer | Yaojian Lin, Xia Feng, Jianmin Fang | 2018-12-25 |
| 10049964 | Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units | Il Kwon Shim, Yaojian Lin, Pandi C. Marimuthu, Yu Gu | 2018-08-14 |
| 9978654 | Semiconductor device and method of forming dual-sided interconnect structures in Fo-WLCSP | Yaojian Lin | 2018-05-22 |
| 9875973 | Semiconductor device and method for forming semiconductor package having build-up interconnect structure over semiconductor die with different CTE insulating layers | Yaojian Lin, Yu Gu, Wei Meng, Chee Siang Ong | 2018-01-23 |
| 9865525 | Semiconductor method and device of forming a fan-out PoP device with PWB vertical interconnect units | Yaojian Lin, Pandi C. Marimuthu, Yu Gu | 2018-01-09 |
| 9865482 | Semiconductor device and method of forming a fan-out structure with integrated passive device and discrete component | Yaojian Lin, Jianmin Fang, Haijing Cao | 2018-01-09 |
| 9847324 | Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP | Yaojian Lin | 2017-12-19 |
| 9842798 | Semiconductor device and method of forming a PoP device with embedded vertical interconnect units | Pandi C. Marimuthu, Yaojian Lin, Yu Gu, Won Kyoung Choi | 2017-12-12 |
| 9837303 | Semiconductor method and device of forming a fan-out device with PWB vertical interconnect units | Yaojian Lin, Yu Gu, Pandi C. Marimuthu | 2017-12-05 |
| 9818734 | Semiconductor device and method of forming build-up interconnect structures over a temporary substrate | Yaojian Lin | 2017-11-14 |
| 9768155 | Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP | Yaojian Lin, Seung Wook Yoon | 2017-09-19 |
| 9754867 | Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package | Yaojian Lin, Jianmin Fang, Xia Feng | 2017-09-05 |
| 9685415 | Semiconductor device and method of forming micro-vias partially through insulating material around bump interconnect | Yaojian Lin | 2017-06-20 |
| 9685350 | Semiconductor device and method of forming embedded conductive layer for power/ground planes in Fo-eWLB | Yaojian Lin, Xu Sheng Bao | 2017-06-20 |
| 9679863 | Semiconductor device and method of forming interconnect substrate for FO-WLCSP | Yaojian Lin, Jianmin Fang, Xia Feng | 2017-06-13 |
| 9666500 | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief | Yaojian Lin, Pandi C. Marimuthu, Hin Hwa Goh, Yu Gu, Il Kwon Shim +4 more | 2017-05-30 |
| 9607965 | Semiconductor device and method of controlling warpage in reconstituted wafer | Kian Meng Heng, Hin Hwa Goh, Jose Alvin Caparas, Seng Guan Chow, Yaojian Lin | 2017-03-28 |
| 9607958 | Semiconductor device and method for forming openings and trenches in insulating layer by first LDA and second LDA for RDL formation | Yaojian Lin, Pandi C. Marimuthu | 2017-03-28 |
| 9601434 | Semiconductor device and method of forming openings through insulating layer over encapsulant for enhanced adhesion of interconnect structure | Yaojian Lin, Jianmin Fang | 2017-03-21 |
| 9558958 | Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation | Yaojian Lin, Jianmin Fang, Xia Feng | 2017-01-31 |
| 9548240 | Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package | Yaojian Lin, Jianmin Fang, Xia Feng | 2017-01-17 |
| 9527723 | Semiconductor device and method of forming microelectromechanical systems (MEMS) package | Yaojian Lin, Won Kyoung Choi, Ivan Micallef | 2016-12-27 |