Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9875973 | Semiconductor device and method for forming semiconductor package having build-up interconnect structure over semiconductor die with different CTE insulating layers | Yaojian Lin, Kang Chen, Yu Gu, Wei Meng | 2018-01-23 |
| 9520365 | Semiconductor device and method for forming semiconductor package having build-up interconnect structure over semiconductor die with different CTE insulating layers | Yaojian Lin, Kang Chen, Yu Gu, Wei Meng | 2016-12-13 |
| 8492203 | Semiconductor device and method for forming semiconductor package having build-up interconnect structure over semiconductor die with different CTE insulating layers | Yaojian Lin, Kang Chen, Yu Gu, Wei Meng | 2013-07-23 |