WM

Wei Meng

ZT Zte: 9 patents #264 of 3,593Top 8%
SC Stats Chippac: 3 patents #282 of 425Top 70%
TL Thomson Licensing: 2 patents #947 of 2,575Top 40%
FC Foxconn (Kunshan) Computer Connector Co.: 2 patents #77 of 177Top 45%
GT Guangdong University Of Technology: 2 patents #64 of 459Top 15%
XC Xi'An Zhongxing New Software Co.: 2 patents #113 of 714Top 20%
Foxconn: 2 patents #200 of 450Top 45%
UM United Microelectronics: 1 patents #2,686 of 4,560Top 60%
CS Chinese Research Academy Of Environmental Sciences: 1 patents #61 of 167Top 40%
GP Globalfoundries Singapore Pte.: 1 patents #427 of 828Top 55%
GL Great Wall Motor Company Limited: 1 patents #145 of 351Top 45%
Huawei: 1 patents #8,196 of 15,535Top 55%
AL Alibaba: 1 patents #1,069 of 2,313Top 50%
Overall (All Time): #115,087 of 4,157,543Top 3%
31
Patents All Time

Issued Patents All Time

Showing 25 most recent of 31 patents

Patent #TitleCo-InventorsDate
12324152 Memory cells with three-dimensional gate coupling and methods of forming thereof Xin Qu, Laiqiang Luo, Fangxin Deng, Fan Zhang 2025-06-03
12221632 Virus lysis and nucleic acid preservation solution Yuandong Liu, Meiying CHEN, Qin Huang, Qingqing Chen, Ning Zhou 2025-02-11
12218821 Method and apparatus for inter-domain data interaction Liang Wang, Liya YUAN 2025-02-04
12074767 Data processing method and device for cooperating with an artificial intelligence management plane, electronic device, and storage medium Liya YUAN 2024-08-27
12038976 Model pushing method and device, model requesting method and device, storage medium and electronic device Liya YUAN 2024-07-16
11994668 Camera module having conductive member electrically connected to lens outer frame and circuit substrate Aixin Xu, Jie Huang, Lian Xu, Qingyue Huang 2024-05-28
11970065 Vehicle control device, vehicle control system and vehicle Tengfei Guo, Zelin GAO, Pengfei Xing, Chao Zhao 2024-04-30
11889354 Method for load imbalance optimization under same network coverage, apparatus, device, and storage medium Dalong Chen, Yongzhang Huo, Jibin Wang 2024-01-30
11851771 Method for constructing porous micro-nano structure, and material with porous micro-nano structure Xinghua Wu, Guohuang Tan, Minghao Xiao 2023-12-26
11743726 Access method and system of internet of things equipment based on 5G, and storage medium Chengming An, Guang Yang, Wenxiang WANG, Jing Zhang, Chao Xu 2023-08-29
11577834 Method and system for synchronizing virtual and real statuses of digital twin system of unmanned aerial vehicle (UAV) Yuanlin Yang, Jiayao Zang, Renquan Lu 2023-02-14
11322872 Plug connector Zheng-Rong Zhu, Jun Chen, Yang-Tsun Hsu 2022-05-03
11282045 Methods, devices, and systems for verifying digital tickets at a client Jie Cao, Yuhui Feng, Xinwei Li, Shuai HE, Chongyuan Tang 2022-03-22
11264743 Plug connector Zheng-Rong Zhu, Jun Chen, Yang-Tsun Hsu 2022-03-01
10461958 Packet transmission method and apparatus Ting Ao, Cui Wang 2019-10-29
10454888 Method and device for processing data message Cui Wang, Bo Wu, Liang Fan 2019-10-22
10419392 Method, device and system for implementing address sharing Cui Wang 2019-09-17
10284426 Method and apparatus for processing service node ability, service classifier and service controller Cui Wang, Yuehua Wei 2019-05-07
10084706 Method and device for processing service function chaining Cui Wang, Bo Wu, Liang Fan 2018-09-25
10063412 Network device detecting method and apparatus, and cloud detection system 2018-08-28
9953458 Method and apparatus for generating shape descriptor of a model Kangying Cai, Tao Luo 2018-04-24
9875973 Semiconductor device and method for forming semiconductor package having build-up interconnect structure over semiconductor die with different CTE insulating layers Yaojian Lin, Kang Chen, Yu Gu, Chee Siang Ong 2018-01-23
9832100 Method, device, and computer storage medium for implementing IP address advertisement Yan Xiang 2017-11-28
9822024 Methods and systems for wastewater treatment and resource recovery Yonghui Song 2017-11-21
9520365 Semiconductor device and method for forming semiconductor package having build-up interconnect structure over semiconductor die with different CTE insulating layers Yaojian Lin, Kang Chen, Yu Gu, Chee Siang Ong 2016-12-13