Issued Patents All Time
Showing 51–75 of 120 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520365 | Semiconductor device and method for forming semiconductor package having build-up interconnect structure over semiconductor die with different CTE insulating layers | Yaojian Lin, Yu Gu, Wei Meng, Chee Siang Ong | 2016-12-13 |
| 9484259 | Semiconductor device and method of forming protection and support structure for conductive interconnect structure | Yaojian Lin, Jianmin Fang | 2016-11-01 |
| 9472452 | Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die | Yaojian Lin, Jianmin Fang, Xia Feng | 2016-10-18 |
| 9449925 | Integrated passive devices | Yaojian Lin, Haijing Cao, Qing Zhang, Jianmin Fang | 2016-09-20 |
| 9449943 | Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern | Yaojian Lin, Hin Hwa Goh, II Kwon Shim | 2016-09-20 |
| 9437552 | Semiconductor device and method of forming insulating layer around semiconductor die | Yaojian Lin, Jianmin Fang, Xia Feng, Xusheng Bao | 2016-09-06 |
| 9401331 | Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP | Yaojian Lin, Xusheng Bao, Jianmin Fang | 2016-07-26 |
| 9385006 | Semiconductor device and method of forming an embedded SOP fan-out package | Yaojian Lin | 2016-07-05 |
| 9385052 | Semiconductor device and method of forming build-up interconnect structures over carrier for testing at interim stages | Yaojian Lin | 2016-07-05 |
| 9385102 | Semiconductor device and method of forming supporting layer over semiconductor die in thin fan-out wafer level chip scale package | Yaojian Lin, Yu Gu | 2016-07-05 |
| 9368563 | Semiconductor device including integrated passive device formed over semiconductor die with conductive bridge and fan-out redistribution layer | Yaojian Lin, Kai Liu | 2016-06-14 |
| 9324700 | Semiconductor device and method of forming shielding layer over integrated passive device using conductive channels | Yaojian Lin, Jianmin Fang, Haijing Cao | 2016-04-26 |
| 9318404 | Semiconductor device and method of forming stress relieving vias for improved fan-out WLCSP package | Yaojian Lin, Pandi C. Marimuthu, Yu Gu | 2016-04-19 |
| 9293401 | Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLP-MLP) | Seung Wook Yoon, Jose Alvin Caparas, Yaojian Lin, Pandi C. Marimuthu, Xusheng Bao +1 more | 2016-03-22 |
| 9281259 | Semiconductor device and method of forming thick encapsulant for stiffness with recesses for stress relief in FO-WLCSP | Yaojian Lin, Jose Alvin Caparas, Glenn Omandam | 2016-03-08 |
| 9269598 | Semiconductor device and method of forming an IPD over a high-resistivity encapsulant separated from other IPDS and baseband circuit | Yaojian Lin, Jianmin Fang, Haijing Cao | 2016-02-23 |
| 9252092 | Semiconductor device and method of forming through mold hole with alignment and dimension control | Yaojian Lin, Yu Gu | 2016-02-02 |
| 9236278 | Integrated circuit packaging system with a substrate embedded dummy-die paddle and method of manufacture thereof | Rui Huang, Xusheng Bao, Yung Kuan Hsiao, Hin Hwa Goh | 2016-01-12 |
| 9202713 | Semiconductor device and method of forming RDL over contact pad with high alignment tolerance or reduced interconnect pitch | Yaojian Lin, Jianmin Fang, Xia Feng | 2015-12-01 |
| 9184103 | Semiconductor device having embedded integrated passive devices electrically interconnected using conductive pillars | Yaojian Lin, Haijing Cao, Jianmin Fang | 2015-11-10 |
| 9142428 | Semiconductor device and method of forming FO-WLCSP with multiple encapsulants | Yaojian Lin, Jose Alvin Caparas, Hin Hwa Goh | 2015-09-22 |
| 9087930 | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief | Yaojian Lin, Pandi C. Marimuthu, Hin Hwa Goh, Yu Gu, Il Kwon Shim +4 more | 2015-07-21 |
| 9082780 | Semiconductor device and method of forming a robust fan-out package including vertical interconnects and mechanical support layer | Yaojian Lin, Yu Gu | 2015-07-14 |
| 9082832 | Semiconductor device and method of forming protection and support structure for conductive interconnect structure | Yaojian Lin, Jianmin Fang | 2015-07-14 |
| 9082806 | Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP | Yaojian Lin | 2015-07-14 |