Issued Patents All Time
Showing 101–120 of 120 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8421212 | Integrated circuit packaging system with active surface heat removal and method of manufacture thereof | Xusheng Bao, Rui Huang, Yung Kuan Hsiao, Hin Hwa Goh | 2013-04-16 |
| 8409970 | Semiconductor device and method of making integrated passive devices | Yaojian Lin, Haijing Cao, Qing Zhang, Jianmin Fang | 2013-04-02 |
| 8409926 | Semiconductor device and method of forming insulating layer around semiconductor die | Yaojian Lin, Jianmin Fang, Xia Feng, Xusheng Bao | 2013-04-02 |
| 8343809 | Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die | Yaojian Lin, Jianmin Fang, Xia Feng | 2013-01-01 |
| 8310058 | Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structures | Yaojian Lin, Haijing Cao, Qing Zhang, Jianmin Fang | 2012-11-13 |
| 8263437 | Semiconductor device and method of forming an IPD over a high-resistivity encapsulant separated from other IPDS and baseband circuit | Yaojian Lin, Jianmin Fang, Haijing Cao | 2012-09-11 |
| 8193604 | Semiconductor package with semiconductor core structure and method of forming the same | Yaojian Lin, Jianmin Fang, Haijing Cao | 2012-06-05 |
| 8183095 | Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation | Yaojian Lin, Jianmin Fang, Xia Feng | 2012-05-22 |
| 8183087 | Semiconductor device and method of forming a fan-out structure with integrated passive device and discrete component | Yaojian Lin, Jianmin Fang, Haijing Cao | 2012-05-22 |
| 8168470 | Semiconductor device and method of forming vertical interconnect structure in substrate for IPD and baseband circuit separated by high-resistivity molding compound | Yaojian Lin, Jianmin Fang, Haijing Cao | 2012-05-01 |
| 8110477 | Semiconductor device and method of forming high-frequency circuit structure and method thereof | Yaojian Lin, Jianmin Fang, Haijing Cao | 2012-02-07 |
| 7935570 | Semiconductor device and method of embedding integrated passive devices into the package electrically interconnected using conductive pillars | Yaojian Lin, Jianmin Fang, Haijing Cao | 2011-05-03 |
| 7858441 | Semiconductor package with semiconductor core structure and method of forming same | Yaojian Lin, Jianmin Fang, Haijing Cao | 2010-12-28 |
| 7790503 | Semiconductor device and method of forming integrated passive device module | Yaojian Lin, Haijing Cao, Qing Zhang, Jianmin Fang | 2010-09-07 |
| 7772081 | Semiconductor device and method of forming high-frequency circuit structure and method thereof | Yaojian Lin, Jianmin Fang, Haijing Cao | 2010-08-10 |
| 7749814 | Semiconductor device with integrated passive circuit and method of making the same using sacrificial substrate | Yaojian Lin, Haijing Cao, Qing Zhang, Jianmin Fang | 2010-07-06 |
| 7691747 | Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structures | Yaojian Lin, Haijing Cao, Qing Zhang, Jianmin Fang | 2010-04-06 |
| 7642128 | Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP | Yaojian Lin, Xusheng Bao, Jianmin Fang | 2010-01-05 |
| 7564183 | Organic electroluminescent display panel with dummy areas | Tzeng-Cherng Luo, Cheng-Fan Lin, Meng-Chieh Liao, Chi-Chung Chen | 2009-07-21 |
| 6837947 | Lead-free solder | Kwang-Lung Lin, Shou-Chang Cheng, Jia-Wei Huang | 2005-01-04 |