VZ

Vladimir Zubkov

Lsi Logic: 20 patents #53 of 1,957Top 3%
Applied Materials: 10 patents #1,290 of 7,310Top 20%
LS Lsi: 1 patents #914 of 1,740Top 55%
📍 Saratov, CA: #1 of 4 inventorsTop 25%
Overall (All Time): #108,612 of 4,157,543Top 3%
33
Patents All Time

Issued Patents All Time

Showing 1–25 of 33 patents

Patent #TitleCo-InventorsDate
8778816 In situ vapor phase surface activation of SiO2 Tatsuya Sato, David Thompson, Jeffrey W. Anthis, Steven Verhaverbeke, Roman Gouk +3 more 2014-07-15
8753989 Method to increase tensile stress of silicon nitride films using a post PECVD deposition UV cure Mihaela Balseanu, Michael S. Cox, Li-Qun Xia, Mei-Yee Shek, Jia-Sheng Lee +4 more 2014-06-17
8501568 Method of forming flash memory with ultraviolet treatment Mihaela Balseanu, Li-Qun Xia, Atif Noori, Reza Arghavani, Derek R. Witty +1 more 2013-08-06
8343881 Silicon dioxide layer deposited with BDEAS Yong Won Lee, Mei-Yee Shek, Li-Qun Xia, Prahallad Iyengar, Sanjeev Baluja +4 more 2013-01-01
8252653 Method of forming a non-volatile memory having a silicon nitride charge trap layer Mihaela Balseanu, Li-Qun Xia, Atif Noori, Reza Arghavani, Derek R. Witty +1 more 2012-08-28
8129290 Method to increase tensile stress of silicon nitride films using a post PECVD deposition UV cure Mihaela Balseanu, Michael S. Cox, Li-Qun Xia, Mei-Yee Shek, Jia-Sheng Lee +4 more 2012-03-06
7829455 Method for creating barriers for copper diffusion Sheldon Aronowitz 2010-11-09
7816205 Method of forming non-volatile memory having charge trap layer with compositional gradient Mihaela Balseanu, Li-Qun Xia, Atif Noori, Reza Arghavani, Derek R. Witty +1 more 2010-10-19
7790635 Method to increase the compressive stress of PECVD dielectric films Mihaela Balseanu, Victor Nguyen, Li-Qun Xia, Derek R. Witty, Hichem M'Saad 2010-09-07
7732342 Method to increase the compressive stress of PECVD silicon nitride films Mihaela Balseanu, Li-Qun Xia, Mei-Yee Shek, Isabelita Rolfox, Hichem M'Saad 2010-06-08
7718548 Selective copper-silicon-nitride layer formation for an improved dielectric film/copper line interface Sang-Mok Lee, Zhenijiang Cui, Meiyee Shek, Li-Qun Xia, Hichem M'Saad 2010-05-18
7508501 Method for measuring spectroscopic properties of bulk products and device for carrying out said method Vladimir Timofeev, Aleksandr Shamrai 2009-03-24
7132336 Method and apparatus for forming a memory structure having an electron affinity region Sheldon Aronowitz, Grace Sun 2006-11-07
7115991 Method for creating barriers for copper diffusion Sheldon Aronowitz 2006-10-03
7081296 Method for growing thin films Sheldon Aronowitz, Richard Schinella 2006-07-25
7015168 Low dielectric constant fluorine and carbon-containing silicon oxide dielectric material characterized by improved resistance to oxidation Sheldon Aronowitz 2006-03-21
7015096 Bimetallic oxide compositions for gate dielectrics Sey-Shing Sun 2006-03-21
6998343 Method for creating barrier layers for copper diffusion Grace Sun, William K. Barth, Sethuraman Lakshminarayanan, Sey-Shing Sun, Agajan Suvkhanov +1 more 2006-02-14
6989565 Memory device having an electron trapping layer in a high-K dielectric gate stack Sheldon Aronowitz, Grace Sun 2006-01-24
6919263 High-K dielectric gate material uniquely formed Sheldon Aronowitz, Grace Sun 2005-07-19
6858195 Process for forming a low dielectric constant fluorine and carbon-containing silicon oxide dielectric material Sheldon Aronowitz 2005-02-22
6822308 Method of chemically altering a silicon surface and associated electrical devices Sheldon Aronowitz 2004-11-23
6747358 Self-aligned alloy capping layers for copper interconnect structures Paul Rissman, Richard Schinella, Sheldon Aronowitz 2004-06-08
6743474 Method for growing thin films Sheldon Aronowitz, Richard Schinella 2004-06-01
6673498 Method for reticle formation utilizing metal vaporization Sheldon Aronowitz, Richard Schinella 2004-01-06