Issued Patents All Time
Showing 25 most recent of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7919060 | Dispenser for flattened articles | Tom Funke, Abner D. Joseph, Peter L. Arnold, James Meador, Randy E. Yoder +1 more | 2011-04-05 |
| 7712210 | Method of providing a printed circuit board with an edge connection portion | Duane A. Stanke, Robert J. Testa | 2010-05-11 |
| 7615477 | Method of fabricating a BGA package having decreased adhesion | John U. Knickerbocker, Voya R. Markovich, William J. Rudik | 2009-11-10 |
| 7582262 | Dispenser for flattened articles | Tom Funke, Abner D. Joseph, Peter L. Arnold, James Meador, Randy E. Yoder +1 more | 2009-09-01 |
| 7547577 | Method of making circuitized substrate with solder paste connections | Norman A. Card, William J. Rudik | 2009-06-16 |
| 7378227 | Method of making a printed wiring board with conformally plated circuit traces | Edmond O. Fey, Raymond T. Galasco, Anita Sargent | 2008-05-27 |
| 7148566 | Method and structure for an organic package with improved BGA life | John U. Knickerbocker, Voya R. Markovich, William J. Rudik | 2006-12-12 |
| 7083901 | Joining member for Z-interconnect in electronic devices without conductive paste | Frank D. Egitto, Voya R. Markovich, Douglas O. Powell, James R. Wilcox | 2006-08-01 |
| 6955849 | Method and structure for small pitch z-axis electrical interconnections | Brian E. Curcio, Frank D. Egitto, Robert M. Japp, Manh-Quan Nguyen, Douglas O. Powell | 2005-10-18 |
| 6905589 | Circuitized substrate and method of making same | Frank D. Egitto, Voya Markovich | 2005-06-14 |
| 6852152 | Colloidal seed formulation for printed circuit board metallization | Raymond T. Galasco, Roy H. Magnuson, Voya R. Markovich, Anita Sargent, William E. Wilson | 2005-02-08 |
| 6845557 | Method for producing an electronic package possessing controlled impedance characteristics | William J. Rudik, Robert J. Testa, Kevin Unger, Michael Wozniak | 2005-01-25 |
| 6815126 | Printed wiring board with conformally plated circuit traces | Edmond O. Fey, Raymond T. Galasco, Anita Sargent | 2004-11-09 |
| 6790305 | Method and structure for small pitch z-axis electrical interconnections | Brian E. Curcio, Frank D. Egitto, Robert M. Japp, Manh-Quan Nguyen, Douglas O. Powell | 2004-09-14 |
| 6740819 | Printed wiring board | Anilkumar C. Bhatt, Ashwinkumar C. Bhatt, Subahu D. Desai, John M. Lauffer, Voya R. Markovich | 2004-05-25 |
| 6630743 | Copper plated PTH barrels and methods for fabricating | Roy H. Magnuson, Voya R. Markovich, Michael Wozniak | 2003-10-07 |
| 6618940 | Fine pitch circuitization with filled plated through holes | Kenneth J. Lubert, Curtis Miller, Robert David Sebesta, James Warren Wilson, Michael Wozniak | 2003-09-16 |
| 6613162 | Multicomponent homogeneous alloys and method for making same | Partha Dutta | 2003-09-02 |
| 6608757 | Method for making a printed wiring board | Anilkumar C. Bhatt, Ashwinkumar C. Bhatt, Subahu D. Desai, John M. Lauffer, Voya R. Markovich | 2003-08-19 |
| 6603834 | X-ray tube anode cold plate | Qing K. Lu, Todd R. Bittner, Allan D. Kautz, Gerald J. Carlson, Jose Angelo Buan +3 more | 2003-08-05 |
| 6593534 | Printed wiring board structure with z-axis interconnections | Gerald W. Jones, John M. Lauffer, Voya R. Markovich, James P. Paoletti, Konstantinos I. Papathomas +1 more | 2003-07-15 |
| 6570102 | Structure for high speed printed wiring boards with multiple differential impedance-controlled layer | Konstantinos I. Papathomas, Brian E. Curcio, Joseph J. Sniezek | 2003-05-27 |
| 6544584 | Process for removal of undesirable conductive material on a circuitized substrate and resultant circuitized substrate | Edward Lee Arrington, John Christopher Camp, Robert Jeffrey Day, Edmond O. Fey, Curtis Michael Gunther | 2003-04-08 |
| 6537608 | Protection of a plated through hole from chemical attack | Kristen A. Stauffer, Michael Wozniak | 2003-03-25 |
| 6479093 | Composite laminate circuit structure and methods of interconnecting the same | John M. Lauffer, Voya R. Markovich, Konstantinos I. Papathomas, William E. Wilson | 2002-11-12 |