| 6730605 |
Redistribution of copper deposited films |
Chantal Arena-Foster, Robert F. Foster, Joseph T. Hillman, Tugrul Yasar |
2004-05-04 |
| 6508919 |
Optimized liners for dual damascene metal wiring |
Joseph T. Hillman |
2003-01-21 |
| 6395095 |
Process apparatus and method for improved plasma processing of a substrate |
William Jones, Robert Rowan, Edward L. Sill |
2002-05-28 |
| 6224724 |
Physical vapor processing of a surface with non-uniformity compensation |
Steven Hurwitt |
2001-05-01 |
| 6214720 |
Plasma process enhancement through reduction of gaseous contaminants |
Edward L. Sill |
2001-04-10 |
| 6200894 |
Method for enhancing aluminum interconnect properties |
Katsuya Okumura, Kenneth P. Rodbell |
2001-03-13 |
| 6197165 |
Method and apparatus for ionized physical vapor deposition |
John Drewery |
2001-03-06 |
| 6132564 |
In-situ pre-metallization clean and metallization of semiconductor wafers |
— |
2000-10-17 |
| 6117279 |
Method and apparatus for increasing the metal ion fraction in ionized physical vapor deposition |
Jason Smolanoff, Doug Caldwell, Jim Zibrida, Bruce Gittleman |
2000-09-12 |
| 6110824 |
Wire shape conferring reduced crosstalk and formation methods |
Jack A. Mandelman |
2000-08-29 |
| 6080287 |
Method and apparatus for ionized physical vapor deposition |
John Drewery |
2000-06-27 |
| 5885425 |
Method for selective material deposition on one side of raised or recessed features |
Julian Hsieh, Donald M. Kenney, James G. Ryan |
1999-03-23 |
| 5874201 |
Dual damascene process having tapered vias |
Ronald W. Nunes, Motoya Okazaki |
1999-02-23 |
| 5800688 |
Apparatus for ionized sputtering |
Alexander D. Lantsman |
1998-09-01 |
| 5796166 |
Tasin oxygen diffusion barrier in multilayer structures |
Paul D. Agnello, Cyril Cabral, Jr., Alfred Grill, Christopher V. Jahnes, Ronnen Andrew Roy |
1998-08-18 |
| 5776823 |
Tasin oxygen diffusion barrier in multilayer structures |
Paul D. Agnello, Cyril Cabral, Jr., Alfred Grill, Christopher V. Jahnes, Ronnen Andrew Roy |
1998-07-07 |
| 5766968 |
Micro mask comprising agglomerated material |
Michael D. Armacost, A. Richard Baker, Jr., Wayne S. Berry, Daniel Carl, Donald McAllpine Kenney |
1998-06-16 |
| 5757879 |
Tungsten absorber for x-ray mask |
Rajiv V. Joshi, Kurt R. Kimmel, James G. Ryan |
1998-05-26 |
| 5726498 |
Wire shape conferring reduced crosstalk and formation methods |
Jack A. Mandelman |
1998-03-10 |
| 5711858 |
Process for depositing a conductive thin film upon an integrated circuit substrate |
Richard S. Kontra, James G. Ryan, Timothy D. Sullivan |
1998-01-27 |
| 5576579 |
Tasin oxygen diffusion barrier in multilayer structures |
Paul D. Agnello, Cyril Cabral, Jr., Alfred Grill, Christopher V. Jahnes, Ronnen Andrew Roy |
1996-11-19 |
| 5545590 |
Conductive rie-resistant collars for studs beneath rie-defined wires |
— |
1996-08-13 |
| 5466626 |
Micro mask comprising agglomerated material |
Michael D. Armacost, A. Richard Baker, Jr., Wayne S. Berry, Daniel Carl, Donald McAllpine Kenney |
1995-11-14 |
| 5401675 |
Method of depositing conductors in high aspect ratio apertures using a collimator |
Pei-Ing Lee, Thomas L. McDevitt, Paul C. Parries, Scott L. Pennington, James G. Ryan +1 more |
1995-03-28 |
| 5356837 |
Method of making epitaxial cobalt silicide using a thin metal underlayer |
Peter J. Geiss, Herbert L. Ho, James G. Ryan |
1994-10-18 |
