Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6489686 | Multi-cavity substrate structure for discrete devices | John U. Knickerbocker, Srinivasa S. N. Reddy | 2002-12-03 |
| 6461493 | Decoupling capacitor method and structure using metal based carrier | Shaji Farooq, John U. Knickerbocker, Robert A. Rita, Srinivasa N. Reddy | 2002-10-08 |
| 6444919 | Thin film wiring scheme utilizing inter-chip site surface wiring | Laertis Economikos, Michael F. McAllister, Eric D. Perfecto, Chandrika Prasad, Keshav Prasad +3 more | 2002-09-03 |
| 6430030 | High k dielectric material with low k dielectric sheathed signal vias | Harvey C. Hamel, Robert A. Rita, Herbert I. Stoller | 2002-08-06 |
| 6339527 | Thin film capacitor on ceramic | John U. Knickerbocker, Srinivasa S. N. Reddy, Robert A. Rita, Roy R. Yu | 2002-01-15 |
| 6335210 | Baseplate for chip burn-in and/of testing, and method thereof | Raymond A. Jackson, Sarah H. Knickerbocker, Sudipta K. Ray | 2002-01-01 |
| 6333563 | Electrical interconnection package and method thereof | Raymond A. Jackson, Anson J. Call, Mark G. Courtney, Stephen A. DeLaurentis, Shaji Farooq +3 more | 2001-12-25 |
| 6281692 | Interposer for maintaining temporary contact between a substrate and a test bed | Paul F. Bodenweber, Ralph R. Comulada, Jr., Charles J. Hendricks, Philo B. Hodge, Vincent P. Peterson +3 more | 2001-08-28 |
| 6255827 | Search routine for 2-point electrical tester | Vincent P. Peterson, Kathleen M. Wiley | 2001-07-03 |
| 6226863 | Reworkability method for wirebond chips using high performance capacitor | Raymond A. Jackson, Sudipta K. Ray | 2001-05-08 |
| 6228682 | Multi-cavity substrate structure for discrete devices | John U. Knickerbocker, Srinivasa S. N. Reddy | 2001-05-08 |
| 6216324 | Method for a thin film multilayer capacitor | Shaji Farooq, Harvey C. Hamel, John U. Knickerbocker, Robert A. Rita, Herbert I. Stoller | 2001-04-17 |
| 6210545 | Method for forming a perovskite thin film using a sputtering method with a fully oxidized perovskite target | Robert A. Rita, Stephen M. Rossnagel | 2001-04-03 |
| 6200400 | Method for making high k dielectric material with low k dielectric sheathed signal vias | Harvey C. Hamel, Robert A. Rita, Herbert I. Stoller | 2001-03-13 |
| 6178082 | High temperature, conductive thin film diffusion barrier for ceramic/metal systems | David E. Kotecki, Robert A. Rita, Stephen M. Rossnagel | 2001-01-23 |
| 6072690 | High k dielectric capacitor with low k sheathed signal vias | Harvey C. Hamel, Robert A. Rita, Herbert I. Stoller | 2000-06-06 |
| 6023407 | Structure for a thin film multilayer capacitor | Shaji Farooq, Harvey C. Hamel, John U. Knickerbocker, Robert A. Rita, Herbert I. Stoller | 2000-02-08 |
| 6015955 | Reworkability solution for wirebound chips using high performance capacitor | Raymond A. Jackson, Sudipta K. Ray | 2000-01-18 |
| 5912044 | Method for forming thin film capacitors | Ajay P. Giri, Rajesh S. Patel | 1999-06-15 |
| 5898222 | Capped copper electrical interconnects | Suryanarayana Kaja, Eric D. Perfecto, George E. White | 1999-04-27 |
| 5874369 | Method for forming vias in a dielectric film | Mark J. LaPlante | 1999-02-23 |
| 5705857 | Capped copper electrical interconnects | Suryanarayana Kaja, Eric D. Perfecto, George E. White | 1998-01-06 |
| 5549808 | Method for forming capped copper electrical interconnects | Suryanarayana Kaja, Eric D. Perfecto, George E. White | 1996-08-27 |
| 5545927 | Capped copper electrical interconnects | Suryanarayana Kaja, Eric D. Perfecto, George E. White | 1996-08-13 |
| 5266446 | Method of making a multilayer thin film structure | Kenneth Chang, George Czornyj, Ananda H. Kumar, Marvin S. Pitler, Heinz O. Steimel | 1993-11-30 |