Issued Patents All Time
Showing 25 most recent of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9927415 | Oil quality sensor and fryer with such oil quality sensor | Michael Baumann, Thomas Ottenthal | 2018-03-27 |
| 7183175 | Shallow trench isolation structure for strained Si on SiGe | Steven J. Koester, Michael Hargrove, Kern Rim, Kevin K. Chan | 2007-02-27 |
| 6825097 | Triple oxide fill for trench isolation | Patricia A. O'Neil, Deborah Ryan, Peter Smeys, Effendi Leobandung | 2004-11-30 |
| 6764922 | Method of formation of an oxynitride shallow trench isolation | Fen F. Jamin, Patrick R. Varekamp | 2004-07-20 |
| 6709951 | Oxynitride shallow trench isolation and method of formation | Fen F. Jamin, Patrick R. Varekamp | 2004-03-23 |
| 6602759 | Shallow trench isolation for thin silicon/silicon-on-insulator substrates by utilizing polysilicon | Atul Ajmera, Dominic J. Schepis | 2003-08-05 |
| 6599813 | Method of forming shallow trench isolation for thin silicon-on-insulator substrates | Dominic J. Schepis | 2003-07-29 |
| 6498383 | Oxynitride shallow trench isolation and method of formation | Fen F. Jamin, Patrick R. Varekamp | 2002-12-24 |
| 5965459 | Method for removing crevices induced by chemical-mechanical polishing | — | 1999-10-12 |
| 5962895 | SOI transistor having a self-aligned body contact | Taqi Nasser Buti, Chang-Ming Hsieh, Louis L. Hsu | 1999-10-05 |
| 5729039 | SOI transistor having a self-aligned body contact | Taqi Nasser Buti, Chang-Ming Hsieh, Louis L. Hsu | 1998-03-17 |
| 5530290 | Large scale IC personalization method employing air dielectric structure for extended conductor | John M. Aitken, Billy L. Crowder, Stephen E. Greco | 1996-06-25 |
| 5444015 | Larce scale IC personalization method employing air dielectric structure for extended conductors | John M. Aitken, Billy L. Crowder, Stephen E. Greco | 1995-08-22 |
| 5405795 | Method of forming a SOI transistor having a self-aligned body contact | Taqi Nasser Buti, Chang-Ming Hsieh, Louis L. Hsu | 1995-04-11 |
| 5391911 | Reach-through isolation silicon-on-insulator device | Andrie S. Yapsir | 1995-02-21 |
| 5366923 | Bonded wafer structure having a buried insulation layer | Chang-Ming Hsieh, Louis L. Hsu, Tsorng-Dih Yuan | 1994-11-22 |
| 5313094 | Thermal dissipation of integrated circuits using diamond paths | Chang-Ming Hsieh, Louis L. Hsu, David E. Kotecki, Tsoring-Dih Yuan | 1994-05-17 |
| 5306659 | Reach-through isolation etching method for silicon-on-insulator devices | Andrie S. Yapsir | 1994-04-26 |
| 5276338 | Bonded wafer structure having a buried insulation layer | Chang-Ming Hsieh, Louis L. Hsu, Tsorng-Dih Yuan | 1994-01-04 |
| 5264387 | Method of forming uniformly thin, isolated silicon mesas on an insulating substrate | Mark A. Jaso, Subramanian S. Iyer, Scott R. Stiffler, James D. Warnock | 1993-11-23 |
| 5234535 | Method of producing a thin silicon-on-insulator layer | Louis L. Hsu, Victor J. Silvestri, Andrie S. Yapsir | 1993-08-10 |
| 5232866 | Isolated films using an air dielectric | Victor J. Silvestri, Andrie S. Yapsir | 1993-08-03 |
| 5227658 | Buried air dielectric isolation of silicon islands | San-Mei Ku, Victor J. Silvestri, Andrie S. Yapsir | 1993-07-13 |
| 5192708 | Sub-layer contact technique using in situ doped amorphous silicon and solid phase recrystallization | Edward C. Fredericks, Louis L. Hsu, David E. Kotecki, Christopher C. Parks | 1993-03-09 |
| 5098856 | Air-filled isolation trench with chemically vapor deposited silicon dioxide cap | Louis L. Hsu, Subodh K. Kulkarni | 1992-03-24 |