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Microelectronic assemblies including interconnects with different solder materials |
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Omni directional interconnect with magnetic fillers in mold matrix |
Bohan Shan, Dingying Xu, Kristof Darmawikarta, Srinivas V. Pietambaram, Hongxia Feng +9 more |
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Lithographically defined vertical interconnect access (VIA) for a bridge die first level interconnect (FLI) |
Kristof Darmawikarta, Tarek A. Ibrahim, Siddharth K. Alur, Rahul Jain |
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Airgap structures for high speed signal integrity |
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Conductive route patterning for electronic substrates |
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| D1021278 |
Pet food dispenser |
Jing Wang |
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Patternable die attach materials and processes for patterning |
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Coffee machine |
Jianping Xiao, Luping Chen |
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Mobile terminal display with graphical user interface for a mobile game assistant |
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