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Electronic substrate stacking |
Lei Shan, Daniel J. Friedman, John U. Knickerbocker |
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| 11784160 |
Asymmetric die bonding |
Katsuyuki Sakuma, Krishna R. Tunga, Shidong Li |
2023-10-10 |
| 10964647 |
Dielectric crack stop for advanced interconnects |
Baozhen Li, Chih-Chao Yang |
2021-03-30 |
| 10957657 |
Advanced crack stop structure |
Chih-Chao Yang, Baozhen Li, Xiao Hu Liu |
2021-03-23 |
| 10847475 |
Advanced crack stop structure |
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2020-11-24 |
| 10840195 |
Advanced crack stop structure |
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2020-11-17 |
| 10840194 |
Advanced crack stop structure |
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2020-11-17 |
| 10734475 |
Stacked MIM capacitors with self-aligned contact to reduce via enclosure |
Takashi Ando, Robert A. Groves, Hemanth Jagannathan, Lawrence A. Clevenger |
2020-08-04 |
| 10490513 |
Advanced crack stop structure |
Chih-Chao Yang, Baozhen Li, Xiao Hu Liu |
2019-11-26 |
| 10475753 |
Advanced crack stop structure |
Chih-Chao Yang, Baozhen Li, Xiao Hu Liu |
2019-11-12 |
| 10396042 |
Dielectric crack stop for advanced interconnects |
Baozhen Li, Chih-Chao Yang |
2019-08-27 |
| 10366940 |
Air gap and air spacer pinch off |
Elbert E. Huang, Son V. Nguyen, Takeshi Nogami, Christopher J. Penny, Deepika Priyadarshini |
2019-07-30 |
| 10256186 |
Interconnect structure having subtractive etch feature and damascene feature |
Samuel S. Choi, Ronald G. Filippi, Elbert E. Huang, Naftali E. Lustig, Andrew H. Simon |
2019-04-09 |
| 10256171 |
Air gap and air spacer pinch off |
Elbert E. Huang, Son V. Nguyen, Takeshi Nogami, Christopher J. Penny, Deepika Priyadarshini |
2019-04-09 |
| 10242933 |
Air gap and air spacer pinch off |
Elbert E. Huang, Son V. Nguyen, Takeshi Nogami, Christopher J. Penny, Deepika Priyadarshini |
2019-03-26 |
| 10229875 |
Stacked via structure for metal fuse applications |
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2019-03-12 |
| 10224236 |
Forming air gap |
Samuel S. Choi, Ronald G. Filippi, Elbert E. Huang, Naftali E. Lustig, Andrew H. Simon |
2019-03-05 |
| 10177031 |
Subtractive etch interconnects |
Junjing Bao, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig, Andrew H. Simon |
2019-01-08 |
| 10177076 |
Air gap and air spacer pinch off |
Elbert E. Huang, Son V. Nguyen, Takeshi Nogami, Christopher J. Penny, Deepika Priyadarshini |
2019-01-08 |
| 10103068 |
Detecting a void between a via and a wiring line |
Samuel S. Choi, Ronald G. Filippi, Elbert E. Huang, Naftali E. Lustig, Andrew H. Simon |
2018-10-16 |
| 9893011 |
Back-end electrically programmable fuse |
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2018-02-13 |
| 9852980 |
Interconnect structure having substractive etch feature and damascene feature |
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2017-12-26 |
| 9793193 |
Air gap and air spacer pinch off |
Elbert E. Huang, Son V. Nguyen, Takeshi Nogami, Christopher J. Penny, Deepika Priyadarshini |
2017-10-17 |
| 9786760 |
Air gap and air spacer pinch off |
Elbert E. Huang, Son V. Nguyen, Takeshi Nogami, Christopher J. Penny, Deepika Priyadarshini |
2017-10-10 |
| 9759766 |
Electromigration test structure for Cu barrier integrity and blech effect evaluations |
Elbert E. Huang, Chao-Kun Hu, Baozhen Li, Paul S. McLaughlin |
2017-09-12 |
