| 10763090 |
High pressure RF-DC sputtering and methods to improve film uniformity and step-coverage of this process |
Adolph Miller Allen, Lara Hawrylchak, Zhigang Xie, Muhammad M. Rasheed, Rongjun Wang +8 more |
2020-09-01 |
| 9695502 |
Process kit with plasma-limiting gap |
Alan A. Ritchie |
2017-07-04 |
| 9534286 |
PVD target for self-centering process shield |
Goichi Yoshidome, Ryan Edwin Hanson, Muhammad M. Rasheed, Keith A. Miller |
2017-01-03 |
| 9404174 |
Pinned target design for RF capacitive coupled plasma |
Alan A. Ritchie |
2016-08-02 |
| 9340866 |
Substrate support with radio frequency (RF) return path |
Alan A. Ritchie, Wei Wang, Ananthkrishna Jupudi, Thanh X. Nguyen, Kirankumar Neelasandra SAVANDAIAH |
2016-05-17 |
| 9343274 |
Process kit shield for plasma enhanced processing chamber |
Muhammad M. Rasheed, Kirankumar Neelasandra SAVANDAIAH, Uday Pai |
2016-05-17 |
| 9303311 |
Substrate processing system with mechanically floating target assembly |
Alan A. Ritchie, Uday Pai, Muhammad M. Rasheed, Keith A. Miller |
2016-04-05 |
| 9255322 |
Substrate processing system having symmetric RF distribution and return paths |
Alan A. Ritchie, Muhammad M. Rasheed, Keith A. Miller |
2016-02-09 |
| 9123511 |
Process kit for RF physical vapor deposition |
Lara Hawrylchak |
2015-09-01 |
| 8795488 |
Apparatus for physical vapor deposition having centrally fed RF energy |
Muhammad M. Rasheed, Lara Hawrylchak, Michael S. Cox, Kirankumar Neelasandra SAVANDAIAH, Alan A. Ritchie |
2014-08-05 |
| 8790499 |
Process kit components for titanium sputtering chamber |
Alan A. Ritchie, Ilyoung (Richard) Hong, Kathleen Scheible |
2014-07-29 |
| 8702918 |
Apparatus for enabling concentricity of plasma dark space |
Alan A. Ritchie, Keith A. Miller, Muhammad M. Rasheed, Steve Sansoni, Uday Pai |
2014-04-22 |
| 8668815 |
Process kit for RF physical vapor deposition |
Lara Hawrylchak |
2014-03-11 |
| 8647484 |
Target for sputtering chamber |
Alan A. Ritchie, Ilyoung (Richard) Hong, Kathleen Scheible, Umesh M. Kelkar |
2014-02-11 |
| 8647485 |
Process kit shield for plasma enhanced processing chamber |
Muhammad M. Rasheed, Kirankumar Neelasandra SAVANDAIAH, Uday Pai |
2014-02-11 |
| 7674360 |
Mechanism for varying the spacing between sputter magnetron and target |
Ilyoung Richard Hong, Michael Rosenstein, Robert B. Lowrance, Daniel C. Lubben, Michael Miller +3 more |
2010-03-09 |
| 7561015 |
Magnet secured in a two part shell |
Anthony Vesci, Alan Liu, Joe Sommers, Kevin Hughes |
2009-07-14 |
| 6875927 |
High temperature DC chucking and RF biasing cable with high voltage isolation for biasable electrostatic chuck applications |
Karl M. Brown, Cheng-Hsiung Tsai, Vineet Haresh Mehta, David H. Loo |
2005-04-05 |
