Issued Patents All Time
Showing 25 most recent of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520323 | Microelectronic packages having trench vias and methods for the manufacture thereof | Michael B. Vincent, Zhiwei Gong, Scott M. Hayes | 2016-12-13 |
| 9502363 | Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layers | Michael B. Vincent, Trung Q. Duong, Zhiwei Gong, Scott M. Hayes, Alan J. Magnus +3 more | 2016-11-22 |
| 9281293 | Microelectronic packages having layered interconnect structures and methods for the manufacture thereof | Alan J. Magnus, Trung Q. Duong, Zhiwei Gong, Scott M. Hayes, Michael B. Vincent +2 more | 2016-03-08 |
| 9142502 | Semiconductor device packaging having pre-encapsulation through via formation using drop-in signal conduits | Zhiwei Gong, Navjot Chhabra, Glenn G. Daves, Scott M. Hayes, Jason Wright | 2015-09-22 |
| 9123685 | Microelectronic packages having frontside thermal contacts and methods for the fabrication thereof | Weng F. Yap | 2015-09-01 |
| 9018045 | Microelectronic packages and methods for the fabrication thereof | Weng F. Yap | 2015-04-28 |
| 8685790 | Semiconductor device package having backside contact and method for manufacturing | Alan J. Magnus, Carl E. D. Acosta, Justin E. Poarch | 2014-04-01 |
| 8283207 | Methods for forming through-substrate conductor filled vias, and electronic assemblies formed using such methods | Chandrasekaram Ramiah, Michael F. Petras, Paul W. Sanders | 2012-10-09 |
| 8216918 | Method of forming a packaged semiconductor device | Zhiwei Gong, Scott M. Hayes, George R. Leal, Jason Wright, Jianwen Xu | 2012-07-10 |
| 8158492 | MEMS microphone with cavity and method therefor | Lianjun Liu | 2012-04-17 |
| 7981730 | Integrated conformal shielding method and process using redistributed chip packaging | Jinbang Tang, Darrel R. Frear, Scott M. Hayes | 2011-07-19 |
| 7950144 | Method for controlling warpage in redistributed chip packaging panels | Lakshmi N. Ramanathan, George R. Leal, Betty Hill-Shan Yeung | 2011-05-31 |
| 7935571 | Through substrate vias for back-side interconnections on very thin semiconductor wafers | Chandrasekaram Ramiah, Michael F. Petras, Paul W. Sanders | 2011-05-03 |
| 7425464 | Semiconductor device packaging | Owen R. Fay, Kevin R. Lish | 2008-09-16 |
| 6878633 | Flip-chip structure and method for high quality inductors and transformers | Glenn D. Raskin, George W. Marlin | 2005-04-12 |
| 6803323 | Method of forming a component overlying a semiconductor substrate | Lakshmi N. Ramanathan, Varughese Mathew | 2004-10-12 |
| 6726826 | Method of manufacturing a semiconductor component | Timothy L. Johnson, Joseph English, David Austin, George F. Carney, Kandis Mae Knoblauch | 2004-04-27 |
| 6517698 | System and method for providing rotation to plating flow | Timothy L. Johnson, Jaynal A. Molla | 2003-02-11 |
| 6436300 | Method of manufacturing electronic components | Eric Woolsey, George F. Carney, Francis J. Carney, Cary B. Powell | 2002-08-20 |
| 6413878 | Method of manufacturing electronic components | Eric Woolsey, George F. Carney, Francis J. Carney, Cary B. Powell | 2002-07-02 |
| 6372622 | Fine pitch bumping with improved device standoff and bump volume | Qing Tan, Stanley Craig Beddingfield | 2002-04-16 |
| 6361675 | Method of manufacturing a semiconductor component and plating tool therefor | Timothy L. Johnson, Joseph English, David Austin, George F. Carney, Kandis Mae Knoblauch | 2002-03-26 |
| 5773359 | Interconnect system and method of fabrication | Francis J. Carney, Eric Woolsey | 1998-06-30 |
| 5480835 | Electrical interconnect and method for forming the same | Francis J. Carney, George F. Carney | 1996-01-02 |
| D328588 | Chock block unit | — | 1992-08-11 |