Issued Patents All Time
Showing 1–25 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12063474 | Methods of environmental protection for silicon MEMS structures in cavity packages | Paul Westmarland, Scott Palmer, Mark Pavier | 2024-08-13 |
| 11574879 | Device package with reduced radio frequency losses | Pedro Augusto Borrego Lambin Torres Amaral, Ewa Brox-Napieralska, Andreas Wiesbauer | 2023-02-07 |
| 11117798 | MEMS-sensor | Gunar Lorenz, Alfons Dehe, Marc Fueldner, Ulrich Krumbein, Andreas Wiesbauer | 2021-09-14 |
| 11040872 | Semiconductor module | Claus Waechter, Edward Fuergut, Michael Ledutke, Dominic Maier | 2021-06-22 |
| 10793419 | MEMS assembly | Marc Fueldner, Niccoló De Milleri, Ulrich Krumbein, Gerhard Lohninger, Giordano Tosolini +1 more | 2020-10-06 |
| 10707158 | Package with vertical interconnect between carrier and clip | Alexander Heinrich, Thorsten Meyer, Gerald Ofner | 2020-07-07 |
| 10570007 | MEMS assembly and method for producing a MEMS assembly | Gunar Lorenz | 2020-02-25 |
| 10549985 | Semiconductor package with a through port for sensor applications | Dominic Maier, Matthias Steiert, Chau Fatt Chiang, Christian Geissler, Thomas Kilger +5 more | 2020-02-04 |
| 10435292 | Method for producing a semiconductor module | Claus Waechter, Edward Fuergut, Michael Ledutke, Dominic Maier | 2019-10-08 |
| 10377626 | Apparatus with a high heat capacity and method for producing the same | Matthias Steiert | 2019-08-13 |
| 10161908 | Apparatus for determining a characteristic of a fluid having a device configured to measure a hydrodynamic pressure of the fluid | Rui Miguel Moreira Araujo, Dominic Maier | 2018-12-25 |
| 8753901 | Semiconductor wafer with electrically connected contact and test areas | Ertle Werner, Michael Horn, Bernd Kothe | 2014-06-17 |
| 8466009 | Method of fabricating a semiconductor package with mold lock opening | Markus Dinkel, Wae Chet Yong, Teck Sim Lee, Boon Kian Lim | 2013-06-18 |
| 8044394 | Semiconductor wafer with electrically connected contact and test areas | Werner Ertle, Michael Horn, Bernd Kothe | 2011-10-25 |
| 7795717 | Electronic component embedded within a plastic compound and including copper columns within the plastic compound extending between upper and lower rewiring layers, and system carrier and panel for producing an electronic component | — | 2010-09-14 |
| 7781899 | Leadframe having mold lock vent | Lee Teck Sim, Yong Wae Chet, Lim Boon Kian | 2010-08-24 |
| 7732937 | Semiconductor package with mold lock vent | Markus Dinkel, Wae Chet Yong, Teck Sim Lee, Boon Kian Lim | 2010-06-08 |
| 7700956 | Sensor component and panel used for the production thereof | Edward Fuergut, Robert-Christian Hagen, Simon Jerebic, Jens Pohl, Peter Strobel +1 more | 2010-04-20 |
| 7701066 | Semiconductor wafer, panel and electronic component with stacked semiconductor chips, and also method for producing same | — | 2010-04-20 |
| 7575173 | Smart card, smart card module, and a method for production of a smart card module | Edward Fuergut, Robert-Christian Hagen, Simon Jerebic, Jens Pohl, Peter Strobel +1 more | 2009-08-18 |
| 7566968 | Biosensor with smart card configuration | Michael Bauer, Robert-Christian Hagen, Gerald Ofner, Christian Stuempfl, Holger Woerner | 2009-07-28 |
| 7524699 | Electronic component and a panel | Edward Fuergut, Robert-Christian Hagen, Simon Jerebic, Jens Pohl, Peter Strobel +1 more | 2009-04-28 |
| 7517722 | Method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds | Robert-Christian Hagen, Gerald Ofner, Christian Stuempfl, Stefan Wein, Holger Wörner | 2009-04-14 |
| 7391103 | Electronic module having plug contacts and method for producing it | Edward Fuergut, Robert-Christian Hagen, Simon Jerebic, Jens Pohl, Holger Woerner +1 more | 2008-06-24 |
| 7276783 | Electronic component with a plastic package and method for production | Robert-Christian Hagen, Gerald Ofner, Christian Stuempfl, Josef Thumbs, Stefan Wein +1 more | 2007-10-02 |