Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11579426 | Dual collimating lens configuration for optical devices | Chia-Pin Chiu | 2023-02-14 |
| 11156815 | Compound parabolic concentrator including protrusion | Chia-Pin Chiu, Amanuel M. Abebaw, Olga Gorbounova, Ching-Ping Janet Shen, Shan Zhong +1 more | 2021-10-26 |
| 11022792 | Coupling a magnet with a MEMS device | Kyle Yazzie, Suriyakala Ramalingam, Liwei Wang, Robert Starkston, Arnab Choudhury +3 more | 2021-06-01 |
| 10615128 | Systems and methods for electromagnetic interference shielding | Rajendra C. Dias, Joshua D. Heppner, Eric J. Li, Nachiket R. Raravikar | 2020-04-07 |
| 10315200 | Apparatus and system for storing and transporting magnetic devices | Amanuel M. Abebaw, Mark Saltas, Liwei Wang | 2019-06-11 |
| 10168357 | Coated probe tips for plunger pins of an integrated circuit package test system | Wen Yin, Teag R. Haughan, Dingying Xu, Joaquin Aguilar-Santillan | 2019-01-01 |
| 10049971 | Package structure to enhance yield of TMI interconnections | Thomas J. De Bonis, Lilia May, Rajen S. Sidhu, Mukul Renavikar, Ashay Dani +6 more | 2018-08-14 |
| 9991211 | Semiconductor package having an EMI shielding layer | Reynaldo A. Olmedo, Venmathy McMahan, Rajendra C. Dias, Joshua D. Heppner, Ann Jinyan Xu +2 more | 2018-06-05 |
| 9953929 | Systems and methods for electromagnetic interference shielding | Rajendra C. Dias, Joshua D. Heppner, Eric J. Li, Nachiket R. Raravikar | 2018-04-24 |
| 9704811 | Perforated conductive material for EMI shielding of semiconductor device and components | Rajendra C. Dias, Joshua D. Heppner, Mitul Modi | 2017-07-11 |
| 9685413 | Semiconductor package having an EMI shielding layer | Reynaldo A. Olmedo, Venmathy McMahan, Rajendra C. Dias, Joshua D. Heppner, Ann Jinyan Xu +2 more | 2017-06-20 |
| 9631065 | Methods of forming wafer level underfill materials and structures formed thereby | James C. Matayabas, Jr., Arjun Krishnan, Nisha Ananthakrishnan | 2017-04-25 |
| 9613933 | Package structure to enhance yield of TMI interconnections | Thomas J. De Bonis, Lilia May, Rajen S. Sidhu, Mukul Renavikar, Ashay Dani +6 more | 2017-04-04 |
| 8183697 | Apparatus and methods of forming an interconnect between a workpiece and substrate | Lakshmi Supriya, Tommy L. Ashton | 2012-05-22 |
| 7843075 | Apparatus and methods of forming an interconnect between a workpiece and substrate | Lakshmi Supriya, Tommy L. Ashton | 2010-11-30 |
| 7776657 | Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same | Ashay Dani, Saikumar Jayaraman, Mitesh Patel, Vijay Wakharkar | 2010-08-17 |
| 7651020 | Amphiphilic block copolymers for improved flux application | Linda A. Shekhawat | 2010-01-26 |
| 7332807 | Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same | Ashay Dani, Saikumar Jayaraman, Mitesh Patel, Vijay Wakharkar | 2008-02-19 |
| 6717561 | Driving a liquid crystal display | Matthias Pfeiffer, Russell Flack | 2004-04-06 |