Issued Patents All Time
Showing 76–100 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10643946 | Nitrogen assisted oxide gapfill | Sudipto Naskar, Manish Chandhok, Ryan Pearce | 2020-05-05 |
| 10615117 | Self-aligned via | Robert L. Bristol, Rami Hourani, James M. Blackwell | 2020-04-07 |
| 10593627 | Doric pillar supported maskless airgap structure for capacitance benefit with unlanded via solution | Kanwal Jit Singh, Robert L. Bristol | 2020-03-17 |
| 10553532 | Structure and method to self align via to top and bottom of tight pitch metal interconnect layers | Richard E. Schenker, Manish Chandhok, Robert L. Bristol, Mauro J. Kobrinsky | 2020-02-04 |
| 10546772 | Self-aligned via below subtractively patterned interconnect | Manish Chandhok, Richard E. Schenker, Hui Jae Yoo, Jasmeet S. Chawla, Stephanie A. Bojarski +3 more | 2020-01-28 |
| 10508961 | Semiconductor package with air pressure sensor | Qing Ma, Feras Eid, Johanna M. Swan, Weng Hong Teh | 2019-12-17 |
| 10457548 | Integrating MEMS structures with interconnects and vias | Chytra Pawashe, Raseong Kim, Ian A. Young, Kanwal Jit Singh, Robert L. Bristol | 2019-10-29 |
| 10366950 | Bottom-up selective dielectric cross-linking to prevent via landing shorts | Robert L. Bristol, James M. Blackwell, Rami Hourani | 2019-07-30 |
| 10366903 | Textile patterning for subtractively-patterned self-aligned interconnects, plugs, and vias | Robert L. Bristol, Alan M. Myers | 2019-07-30 |
| 10156583 | Method of making an accelerometer | Qing Ma, Valluri Rao, Feras Eid, Weng Hong Teh, Johanna M. Swan +1 more | 2018-12-18 |
| 10109583 | Method for creating alternate hardmask cap interconnect structure with increased overlay margin | Robert L. Bristol, Manish Chandhok, Jasmeet S. Chawla, Florian Gstrein, Eungnak Han +3 more | 2018-10-23 |
| 9947805 | Nanowire-based mechanical switching device | Chytra Pawashe, Anurag Chaudhry, Raseong Kim, Seiyon Kim, Kelin J. Kuhn +3 more | 2018-04-17 |
| 9926193 | Magnetic nanomechanical devices for stiction compensation | Jorge Munoz, Dmitri E. Nikonov, Kelin J. Kuhn, Patrick Theofanis, Chytra Pawashe +1 more | 2018-03-27 |
| 9824642 | Rendering techniques for textured displays | Nathan R. Andrysco | 2017-11-21 |
| 9674945 | Heterogeneous integration of microfluidic devices in package structures | Weng Hong Teh, Feras Eid, Qing Ma | 2017-06-06 |
| 9553018 | Self-aligned via and plug patterning with photobuckets for back end of line (BEOL) interconnects | Robert L. Bristol, Kanwal Jit Singh, Alan M. Myers, Richard E. Schenker | 2017-01-24 |
| 9513529 | Display apparatus including MEMS devices | Nathan R. Andrysco | 2016-12-06 |
| 9489928 | Adjustment of monitor resolution and pixel refreshment based on detected viewer distance | Nathan R. Andrysco | 2016-11-08 |
| 9429427 | Inductive inertial sensor architecture and fabrication in packaging build-up layers | Qing Ma, Feras Eid, Johanna M. Swan, Weng Hong Teh, Valluri Rao | 2016-08-30 |
| 9362074 | Nanowire-based mechanical switching device | Chytra Pawashe, Anurag Chaudhry, Raseong Kim, Seiyon Kim, Kelin J. Kuhn +3 more | 2016-06-07 |
| 9324652 | Method of creating a maskless air gap in back end interconnections with double self-aligned vias | Manish Chandhok, Hui Jae Yoo, Yan Borodovsky, Florian Gstrein, David Shykind | 2016-04-26 |
| 9297824 | Techniques, systems and devices related to acceleration measurement | Qing Ma, Valluri Rao, Feras Eid, Weng Hong Teh, Johanna M. Swan +1 more | 2016-03-29 |
| 9250261 | Method, apparatus and system for providing metering of acceleration | Feras Eid, Qing Ma | 2016-02-02 |
| 9236342 | Self-aligned via and plug patterning with photobuckets for back end of line (BEOL) interconnects | Robert L. Bristol, Kanwal Jit Singh, Alan M. Myers, Richard E. Schenker | 2016-01-12 |
| 9200973 | Semiconductor package with air pressure sensor | Qing Ma, Feras Eid, Johanna M. Swan, Weng Hong Teh | 2015-12-01 |