Issued Patents All Time
Showing 51–75 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11335598 | Grating replication using helmets and topographically-selective deposition | Sudipto Naskar, Manish Chandhok, Miriam Reshotko, Rami Hourani | 2022-05-17 |
| 11328992 | Integrated circuit components with dummy structures | Nicholas James Harold McKubre, Richard Vreeland, Sansaptak Dasgupta | 2022-05-10 |
| 11276644 | Integrated circuits and methods for forming thin film crystal layers | Carl Naylor, Ashish Agrawal, Abhishek A. Sharma, Mauro J. Kobrinsky, Christopher J. Jezewski +1 more | 2022-03-15 |
| 11276581 | Textile patterning for subtractively-patterned self-aligned interconnects, plugs, and vias | Robert L. Bristol, Alan M. Myers | 2022-03-15 |
| 11251072 | Differential hardmasks for modulation of electrobucket sensitivity | Robert L. Bristol, James M. Blackwell, Rami Hourani, Marie Krysak | 2022-02-15 |
| 11205586 | Integrated circuits with line breaks and line bridges within a single interconnect level | Christopher J. Jezewski | 2021-12-21 |
| 11201114 | Methods of forming thin film resistor structures utilizing interconnect liner materials | Christopher J. Jezewski, Richard Vreeland, Tristan A. Tronic | 2021-12-14 |
| 11189790 | Spacer-based patterning for tight-pitch and low-variability random access memory (RAM) bit cells and the resulting structures | Sarah Atanasov, Kevin P. O'Brien, Robert L. Bristol | 2021-11-30 |
| 11164809 | Integrated circuits and methods for forming integrated circuits | Carl Naylor, Ashish Agrawal, Abhishek A. Sharma, Mauro J. Kobrinsky, Christopher J. Jezewski +1 more | 2021-11-02 |
| 11158515 | Selective metal removal for conductive interconnects in integrated circuitry | Rahim Kasim, Manish Chandhok, Florian Gstrein | 2021-10-26 |
| 11152514 | Multi-layer crystalline back gated thin film transistor | Van H. Le, Abhishek A. Sharma, Gilbert Dewey, Kent Millard, Jack T. Kavalieros +6 more | 2021-10-19 |
| 11152254 | Pitch quartered three-dimensional air gaps | Manish Chandhok, Sudipto Naskar, Stephanie A. Bojarski, Marie Krysak, Tristan A. Tronic +3 more | 2021-10-19 |
| 11137681 | Lined photobucket structure for back end of line (BEOL) interconnect formation | James M. Blackwell, Robert L. Bristol, Marie Krysak, Florian Gstrein, Eungnak Han +2 more | 2021-10-05 |
| 11121691 | Resonator structure encapsulation | Kimin Jun, Edris M. Mohammed | 2021-09-14 |
| 11024538 | Hardened plug for improved shorting margin | Tayseer Mahdi, Jessica M. Torres, Jeffery D. Bielefeld, Marie Krysak, James M. Blackwell | 2021-06-01 |
| 11011481 | Configurable resistor | James M. Blackwell | 2021-05-18 |
| 11011463 | Dielectric helmet-based approaches for back end of line (BEOL) interconnect fabrication and structures resulting therefrom | Richard E. Schenker, Jeffery D. Bielefeld, Rami Hourani, Manish Chandhok | 2021-05-18 |
| 10971393 | Metal-insulator-metal (MIM) structure supporting high voltage applications and low voltage applications | — | 2021-04-06 |
| 10916499 | Vias and gaps in semiconductor interconnects | Manish Chandhok | 2021-02-09 |
| 10892184 | Photobucket floor colors with selective grafting | Robert L. Bristol, James M. Blackwell, Rami Hourani, Eungnak Han | 2021-01-12 |
| 10892223 | Advanced lithography and self-assembled devices | Richard E. Schenker, Robert L. Bristol, Florian Gstrein, James M. Blackwell, Marie Krysak +6 more | 2021-01-12 |
| 10886175 | Differentiated molecular domains for selective hardmask fabrication and structures resulting therefrom | Eungnak Han, Rami Hourani, Florian Gstrein, Gurpreet Singh, Scott B. Clendenning +1 more | 2021-01-05 |
| 10867853 | Subtractive plug and tab patterning with photobuckets for back end of line (BEOL) spacer-based interconnects | Robert L. Bristol, Richard E. Schenker | 2020-12-15 |
| 10804141 | Damascene plug and tab patterning with photobuckets for back end of line (BEOL) spacer-based interconnects | Robert L. Bristol, Richard E. Schenker | 2020-10-13 |
| 10796909 | Surface-aligned lithographic patterning approaches for back end of line (BEOL) interconnect fabrication | Robert L. Bristol, James M. Blackwell | 2020-10-06 |