Issued Patents All Time
Showing 26–50 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11715791 | Group III-Nitride devices on SOI substrates having a compliant layer | Marko Radosavljevic, Han Wui Then, Sansaptak Dasgupta, Paul B. Fischer | 2023-08-01 |
| 11710636 | Metal and spacer patterning for pitch division with multiple line widths and spaces | Charles H. Wallace | 2023-07-25 |
| 11705395 | Core fill to reduce dishing and metal pillar fill to increase metal density of interconnects | — | 2023-07-18 |
| 11670588 | Selectable vias for back end of line interconnects | Christopher J. Jezewski, Ashish Agrawal, Abhishek A. Sharma, Carl Naylor, Urusa Alaan | 2023-06-06 |
| 11664305 | Staggered lines for interconnect performance improvement and processes for forming such | Manish Chandhok, Miriam Reshotko, Christopher J. Jezewski, Eungnak Han, Gurpreet Singh +2 more | 2023-05-30 |
| 11664270 | Metal-insulator-metal (MIM) structure supporting high voltage applications and low voltage applications | — | 2023-05-30 |
| 11646266 | Helmet structures for semiconductor interconnects | Miriam Reshotko, Nafees Kabir | 2023-05-09 |
| 11626451 | Magnetic memory device with ruthenium diffusion barrier | Emily Walker, Carl Naylor, Kaan Oguz, Tanay Gosavi, Christopher J. Jezewski +6 more | 2023-04-11 |
| 11616014 | Peripheral inductors | Paul B. Fischer | 2023-03-28 |
| 11605592 | Method to fabricate metal and ferromagnetic metal multilayer interconnect line for skin effect suppression | Noriyuki Sato, Kevin P. O'Brien, Hui Jae Yoo | 2023-03-14 |
| 11594485 | Local interconnect with air gap | Scott B. Clendenning, Tristan A. Tronic, Urusa Alaan, Ehren Mannebach | 2023-02-28 |
| 11557536 | Integrated circuits (IC's) with electro-migration (EM)—resistant segments in an interconnect level | Christopher J. Jezewski, Manish Chandhok | 2023-01-17 |
| 11502031 | Multiple layer metal-insulator-metal (MIM) structure | — | 2022-11-15 |
| 11482622 | Adhesion structure for thin film transistor | Abhishek A. Sharma, Carl Naylor, Urusa Alaan, Christopher J. Jezewski, Ashish Agrawal | 2022-10-25 |
| 11469189 | Inductor and transmission line with air gap | — | 2022-10-11 |
| 11462469 | Single mask lithography line end enhancement | Nafees Kabir, Richard E. Schenker | 2022-10-04 |
| 11444024 | Subtractively patterned interconnect structures for integrated circuits | Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Christopher J. Jezewski, Jiun-Ruey Chen +10 more | 2022-09-13 |
| 11437255 | Epitaxial III-N nanoribbon structures for device fabrication | Sansaptak Dasgupta, Marko Radosavljevic, Han Wui Then, Paul B. Fischer | 2022-09-06 |
| 11404482 | Self-aligned repeatedly stackable 3D vertical RRAM | Noriyuki Sato, Kevin P. O'Brien, Eungnak Han, Manish Chandhok, Gurpreet Singh +4 more | 2022-08-02 |
| 11398545 | Single-mask, high-q performance metal-insulator-metal capacitor (MIMCAP) | Han Wui Then | 2022-07-26 |
| 11373950 | Advanced lithography and self-assembled devices | Richard E. Schenker, Robert L. Bristol, Florian Gstrein, James M. Blackwell, Marie Krysak +6 more | 2022-06-28 |
| 11373900 | Damascene plug and tab patterning with photobuckets | Robert L. Bristol, Richard E. Schenker | 2022-06-28 |
| 11367684 | Recessed metal interconnects to mitigate EPE-related via shorting | Ehren Mannebach, Richard Vreeland | 2022-06-21 |
| 11367682 | Vias and gaps in semiconductor interconnects | — | 2022-06-21 |
| 11335777 | Integrated circuit components with substrate cavities | Paul B. Fischer, Han Wui Then, Sansaptak Dasgupta, Marko Radosavljevic, Ibrahim Ban | 2022-05-17 |