Issued Patents All Time
Showing 76–100 of 341 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8932796 | Hybrid photoresist composition and pattern forming method using thereof | Kuang-Jung Chen, Wu-Song Huang, Sen Liu, Gregory Breyta | 2015-01-13 |
| 8921030 | Tone inversion of self-assembled self-aligned structures | Michael A. Guillorn, Chi-Chun Liu, Hiroyuki Miyazoe, HsinYu Tsai | 2014-12-30 |
| 8916337 | Dual hard mask lithography process | John C. Arnold, Sean D. Burns, David V. Horak, Muthumanickam Sankarapandian, Yunpeng Yin | 2014-12-23 |
| 8900961 | Selective deposition of germanium spacers on nitride | Ashima B. Chakravarti, Anthony I. Chou, Toshiharu Furukawa, Wesley C. Natzle | 2014-12-02 |
| 8871596 | Method of multiple patterning to form semiconductor devices | Kuang-Jung Chen, Kangguo Cheng, Bruce B. Doris, Sen Liu | 2014-10-28 |
| 8859433 | DSA grapho-epitaxy process with etch stop material | Jassem A. Abdallah, Matthew E. Colburn, Daiji Kawamura, Chi-Chun Liu, Muthumanickam Sankarapandian +1 more | 2014-10-14 |
| 8853085 | Grapho-epitaxy DSA process with dimension control of template pattern | Jassem A. Abdallah, Matthew E. Colburn, Chi-Chun Liu | 2014-10-07 |
| 8835305 | Method of fabricating a profile control in interconnect structures | Chih-Chao Yang, Shyng-Tsong Chen, Samuel S. Choi, David V. Horak, Charles W. Koburger, III +4 more | 2014-09-16 |
| 8803321 | Dual damascene dual alignment interconnect scheme | David V. Horak, Charles W. Koburger, III, Shom Ponoth, Chih-Chao Yang | 2014-08-12 |
| 8771929 | Tone inversion of self-assembled self-aligned structures | Michael A. Guillorn, Chi-Chun Liu, Hiroyuki Miyazoe, HsinYu Tsai | 2014-07-08 |
| 8716127 | Metal alloy cap integration | Chih-Chao Yang, Marc A. Bergendahl, David V. Horak, Charles W. Koburger, III, Shom Ponoth | 2014-05-06 |
| 8715917 | Simultaneous photoresist development and neutral polymer layer formation | Jassem A. Abdallah, Joy Cheng, Matthew E. Colburn, Chi-Chun Liu | 2014-05-06 |
| 8715907 | Developable bottom antireflective coating compositions for negative resists | Kuang-Jung Chen, Wu-Song Huang, Sen Liu | 2014-05-06 |
| 8697561 | Microelectronic structure by selective deposition | Toshiharu Furukawa, David V. Horak, Charles W. Koburger, III | 2014-04-15 |
| 8623458 | Methods of directed self-assembly, and layered structures formed therefrom | Joy Cheng, Matthew E. Colburn, Stefan Harrer, William D. Hinsberg, Ho-Cheol Kim +1 more | 2014-01-07 |
| 8569168 | Dual-metal self-aligned wires and vias | David V. Horak, Charles W. Koburger, III, Shom Ponoth, Chih-Chao Yang | 2013-10-29 |
| 8569868 | Device having and method for forming fins with multiple widths | Kangguo Cheng, Bruce B. Doris, Xuefeng Hua, Ying Zhang | 2013-10-29 |
| 8568604 | CMOS gate structures fabricated by selective oxidation | Bruce B. Doris, Toshiharu Furukawa, Mark C. Hakey, David V. Horak, Charles W. Koburger, III | 2013-10-29 |
| 8541823 | Field effect transistor | Toshiharu Furukawa, Mark C. Hakey, David V. Horak, Charles W. Koburger, III | 2013-09-24 |
| 8536031 | Method of fabricating dual damascene structures using a multilevel multiple exposure patterning scheme | John C. Arnold, Kuang-Jung Chen, Matthew E. Colburn, Dario L. Goldfarb, Stefan Harrer +1 more | 2013-09-17 |
| 8512458 | Chemical and particulate filters containing chemically modified carbon nanotube structures | Mark C. Hakey, David V. Horak, James G. Ryan | 2013-08-20 |
| 8507187 | Multi-exposure lithography employing a single anti-reflective coating layer | Veeraraghavan S. Basker, Willard E. Conley, David V. Horak | 2013-08-13 |
| 8492274 | Metal alloy cap integration | Chih-Chao Yang, Marc A. Bergendahl, David V. Horak, Charles W. Koburger, III, Shom Ponoth | 2013-07-23 |
| 8470711 | Tone inversion with partial underlayer etch for semiconductor device formation | John C. Arnold, Sean D. Burns, Matthew E. Colburn, Yunpeng Yin | 2013-06-25 |
| 8324036 | Device having and method for forming fins with multiple widths for an integrated circuit | Kangguo Cheng, Bruce B. Doris, Xuefeng Hua, Ying Zhang | 2012-12-04 |