Issued Patents All Time
Showing 101–125 of 135 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8163658 | Multiple patterning using improved patternable low-k dielectric materials | — | 2012-04-24 |
| 8101236 | Method of fabricating a SiCOH dielectric material with improved toughness and improved Si-C bonding | Daniel C. Edelstein, Stephen M. Gates, Alfred Grill, Michael Lane, Robert D. Miller +2 more | 2012-01-24 |
| 8084862 | Interconnect structures with patternable low-k dielectrics and method of fabricating same | Shyng-Tsong Chen | 2011-12-27 |
| 8029971 | Photopatternable dielectric materials for BEOL applications and methods for use | Robert David Allen, Phillip Brock, Blake Davis, Robert D. Miller, Alshakim Nelson +1 more | 2011-10-04 |
| 8017522 | Mechanically robust metal/low-κ interconnects | Terry A. Spooner, Darshan Gandhi, Christy S. Tyberg | 2011-09-13 |
| 7944055 | Spin-on antireflective coating for integration of patternable dielectric materials and interconnect structures | Robert David Allen, Phillip Brock, Blake Davis, Wu-Song Huang, Alshakim Nelson +2 more | 2011-05-17 |
| 7919225 | Photopatternable dielectric materials for BEOL applications and methods for use | Robert David Allen, Phillip Brock, Blake Davis, Geraud Jean-Michel Dubois, Robert D. Miller +3 more | 2011-04-05 |
| 7867689 | Method of use for photopatternable dielectric materials for BEOL applications | Robert David Allen, Phillip Brock, Blake Davis, Robert D. Miller, Alshakim Nelson +1 more | 2011-01-11 |
| 7816253 | Surface treatment of inter-layer dielectric | Shyng-Tsong Chen, Kelly Malone, Sanjay C. Mehta, Terry A. Spooner, Chih-Chao Yang | 2010-10-19 |
| 7811923 | Integrated wafer processing system for integration of patternable dielectric materials | Sampath Purushothaman, Robert L. Wisnieff | 2010-10-12 |
| 7795740 | Adhesion enhancement for metal/dielectric interface | Chih-Chao Yang, Griselda Bonilla, Terry A. Spooner | 2010-09-14 |
| 7736833 | Multilayered resist systems using tuned polymer films as underlayers and methods of fabrication thereof | Marie Angelopoulos, Katherina Babich, Douglas Charles LaTulipe, David R. Medeiros, Wayne M. Moreau +2 more | 2010-06-15 |
| 7714079 | Patternable low dielectric constant materials and their use in ULSI interconnection | Ratnam Sooriyakumaran | 2010-05-11 |
| 7709370 | Spin-on antireflective coating for integration of patternable dielectric materials and interconnect structures | Robert David Allen, Phillip Brock, Blake Davis, Wu-Song Huang, Alshakim Nelson +2 more | 2010-05-04 |
| 7709177 | Multilayered resist systems using tuned polymer films as underlayers and methods of fabrication thereof | Marie Angelopoulos, Katherina Babich, Douglas Charles LaTulipe, David R. Medeiros, Wayne M. Moreau +2 more | 2010-05-04 |
| 7666794 | Multiple patterning using patternable low-k dielectric materials | — | 2010-02-23 |
| 7598169 | Method to remove beol sacrificial materials and chemical residues by irradiation | Elbert E. Huang, Christy S. Tyberg, Ronald A. DellaGuardia | 2009-10-06 |
| 7479306 | SiCOH dielectric material with improved toughness and improved Si-C bonding, semiconductor device containing the same, and method to make the same | Daniel C. Edelstein, Stephen M. Gates, Alfred Grill, Michael Lane, Robert D. Miller +2 more | 2009-01-20 |
| 7446058 | Adhesion enhancement for metal/dielectric interface | Chih-Chao Yang, Griselda Bonilla, Terry A. Spooner | 2008-11-04 |
| 7361444 | Multilayered resist systems using tuned polymer films as underlayers and methods of fabrication thereof | Marie Angelopoulos, Katherina Babich, Douglas Charles LaTulipe, David R. Medeiros, Wayne M. Moreau +2 more | 2008-04-22 |
| 7306853 | Patternable low dielectric constant materials and their use in ULSI interconnection | Ratnam Sooriyakumaran | 2007-12-11 |
| 7214603 | Method for fabricating interconnect structures with reduced plasma damage | Ronald A. DellaGuardia, Elbert E. Huang, Robert D. Miller | 2007-05-08 |
| 7141692 | Molecular photoresists containing nonpolymeric silsesquioxanes | Robert David Allen, Wu-Song Huang, Mahmoud Khojasteh, Dirk Pfeiffer, Ratnam Sooriyakumaran +1 more | 2006-11-28 |
| 7041748 | Patternable low dielectric constant materials and their use in ULSI interconnection | Ratnam Sooriyakumaran | 2006-05-09 |
| 6821718 | Radiation sensitive silicon-containing negative resists and use thereof | Marie Angelopoulos, Ari Aviram, Wu-Song Huang, Ranee W. Kwong, Robert N. Lang +1 more | 2004-11-23 |