Issued Patents All Time
Showing 76–100 of 135 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8642252 | Methods for fabrication of an air gap-containing interconnect structure | Lawrence A. Clevenger, Maxime Darnon, Satyanarayana V. Nitta, Anthony D. Lisi | 2014-02-04 |
| 8637395 | Methods for photo-patternable low-k (PPLK) integration with curing after pattern transfer | Maxime Darnon | 2014-01-28 |
| 8629561 | Air gap-containing interconnect structure having photo-patternable low k material | Lawrence A. Clevenger, Maxime Darnon, Anthony D. Lisi, Satyanarayana V. Nitta | 2014-01-14 |
| 8623761 | Method of forming a graphene cap for copper interconnect structures | Griselda Bonilla, Christos D. Dimitrakopoulos, Alfred Grill, James B. Hannon, Deborah A. Neumayer +3 more | 2014-01-07 |
| 8618663 | Patternable dielectric film structure with improved lithography and method of fabricating same | Deborah A. Neumayer | 2013-12-31 |
| 8617941 | High-speed graphene transistor and method of fabrication by patternable hard mask materials | Damon B. Farmer, Yu-Ming Lin | 2013-12-31 |
| 8519540 | Self-aligned dual damascene BEOL structures with patternable low- K material and methods of forming same | Shyng-Tsong Chen, Sampath Purushothaman, Terry A. Spooner, Shawn Walsh | 2013-08-27 |
| 8487411 | Multiple patterning using improved patternable low-κ dielectric materials | — | 2013-07-16 |
| 8475667 | Method of patterning photosensitive material on a substrate containing a latent acid generator | Maxime Darnon, Pratik P. Joshi | 2013-07-02 |
| 8476758 | Airgap-containing interconnect structure with patternable low-k material and method of fabricating | — | 2013-07-02 |
| 8470516 | Method of forming a relief pattern by e-beam lithography using chemical amplification, and derived articles | Robert David Allen, Luisa D. Bozano, Phillip Brock, Alshakim Nelson, Ratnam Sooriyakumaran | 2013-06-25 |
| 8461039 | Patternable low-K dielectric interconnect structure with a graded cap layer and method of fabrication | Deborah A. Neumayer | 2013-06-11 |
| 8450854 | Interconnect structures with patternable low-k dielectrics and method of fabricating same | Shyng-Tsong Chen | 2013-05-28 |
| 8445377 | Mechanically robust metal/low-k interconnects | Terry A. Spooner, Darshan Gandhi, Christy S. Tyberg | 2013-05-21 |
| 8431670 | Photo-patternable dielectric materials and formulations and methods of use | Robert David Allen, Phillip Brock, Blake Davis, Robert D. Miller, Alshakim Nelson +1 more | 2013-04-30 |
| 8415248 | Self-aligned dual damascene BEOL structures with patternable low-k material and methods of forming same | Shyng-Tsong Chen, Sampath Purushothaman, Terry A. Spooner, Shawn Walsh | 2013-04-09 |
| 8389663 | Photo-patternable dielectric materials curable to porous dielectric materials, formulations, precursors and methods of use thereof | Phillip Brock, Robert D. Miller, Alshakim Nelson, Jitendra S. Rathore, Ratnam Sooriyakumaran | 2013-03-05 |
| 8373271 | Interconnect structure with an oxygen-doped SiC antireflective coating and method of fabrication | Dario L. Goldfarb, Ranee W. Kwong, Deborah A. Neumayer, Hosadurga Shobha | 2013-02-12 |
| 8367540 | Interconnect structure including a modified photoresist as a permanent interconnect dielectric and method of fabricating same | — | 2013-02-05 |
| 8354339 | Methods to form self-aligned permanent on-chip interconnect structures | — | 2013-01-15 |
| 8334203 | Interconnect structure and method of fabricating | Dirk Pfeiffer, Ratnam Sooriyakumaran | 2012-12-18 |
| 8298937 | Interconnect structure fabricated without dry plasma etch processing | Maxime Darnon, Jeffrey P. Gambino, Elbert E. Huang | 2012-10-30 |
| 8241992 | Method for air gap interconnect integration using photo-patternable low k material | Lawrence A. Clevenger, Maxime Darnon, Anthony D. Lisi, Satyanarayana V. Nitta | 2012-08-14 |
| 8232198 | Self-aligned permanent on-chip interconnect structure formed by pitch splitting | — | 2012-07-31 |
| 8202783 | Patternable low-k dielectric interconnect structure with a graded cap layer and method of fabrication | Deborah A. Neumayer | 2012-06-19 |