QL

Qinghuang Lin

IBM: 114 patents #453 of 70,183Top 1%
Globalfoundries: 9 patents #393 of 4,424Top 9%
BS Boston Scientific: 6 patents #119 of 370Top 35%
Lam Research: 2 patents #1,015 of 2,128Top 50%
Samsung: 2 patents #37,631 of 75,807Top 50%
GU Globalfoundries U.S.: 1 patents #22 of 211Top 15%
📍 Yorktown Heights, NY: #14 of 858 inventorsTop 2%
🗺 New York: #294 of 115,490 inventorsTop 1%
Overall (All Time): #7,729 of 4,157,543Top 1%
135
Patents All Time

Issued Patents All Time

Showing 51–75 of 135 patents

Patent #TitleCo-InventorsDate
9299847 Printed transistor and fabrication method Minhua Lu, Robert L. Wisnieff 2016-03-29
9245791 Method for fabricating a contact Ying Zhang 2016-01-26
9236298 Methods for fabrication interconnect structures with functional components and electrical conductive contact structures on a same level Dirk Pfeiffer 2016-01-12
9209126 Self-aligned fine pitch permanent on-chip interconnect structures and method of fabrication Sanjay C. Mehta, Hosadurga Shobha 2015-12-08
9196523 Self-aligned permanent on-chip interconnect structures 2015-11-24
9171742 Alignment of integrated circuit chip stack Evan G. Colgan, Steven A. Cordes, Daniel C. Edelstein, Vijayeshwar D. Khanna, Kenneth F. Latzko +4 more 2015-10-27
9087753 Printed transistor and fabrication method Minhua Lu, Robert L. Wisnieff 2015-07-21
9059249 Interconnect structures containing a photo-patternable low-k dielectric with a curved sidewall surface Maxime Darnon 2015-06-16
9054160 Interconnect structure and method for fabricating on-chip interconnect structures by image reversal Robert L. Bruce, Alshakim Nelson, Satyanarayana V. Nitta, Dirk Pfeiffer, Jitendra S. Rathore 2015-06-09
9035462 Airgap-containing interconnect structure with patternable low-k material and method of fabricating 2015-05-19
9012587 Photo-patternable dielectric materials and formulations and methods of use Robert David Allen, Phillip Brock, Blake Davis, Robert D. Miller, Alshakim Nelson +1 more 2015-04-21
9006373 Photo-patternable dielectric materials curable to porous dielectric materials, formulations, precursors and methods of use thereof Phillip Brock, Robert D. Miller, Alshakim Nelson, Jitendra S. Rathore, Ratnam Sooriyakumaran 2015-04-14
8952539 Methods for fabrication of an air gap-containing interconnect structure Lawrence A. Clevenger, Maxime Darnon, Satyanarayana V. Nitta, Anthony D. Lisi 2015-02-10
8946371 Photo-patternable dielectric materials curable to porous dielectric materials, formulations, precursors and methods of use thereof Phillip Brock, Blake Davis, Robert D. Miller, Alshakim Nelson, Jitendra S. Rathore +1 more 2015-02-03
8920567 Post metal chemical-mechanical planarization cleaning process Vamsi Devarapalli, Colin J. Goyette, Michael R. Kennett, Mahmoud Khojasteh, James J. Steffes +2 more 2014-12-30
8916978 Interconnect structure and method of fabricating Dirk Pfeiffer, Ratnam Sooriyakumaran 2014-12-23
8900988 Method for forming self-aligned airgap interconnect structures Benjamin L. Fletcher, Cyril Cabral, Jr. 2014-12-02
8896120 Structures and methods for air gap integration Lawrence A. Clevenger, Maxime Darnon, Anthony D. Lisi, Satyanarayana V. Nitta 2014-11-25
8895433 Method of forming a graphene cap for copper interconnect structures Griselda Bonilla, Christos D. Dimitrakopoulos, Alfred Grill, James B. Hannon, Deborah A. Neumayer +3 more 2014-11-25
8890318 Middle of line structures Ying Zhang 2014-11-18
8853856 Methodology for evaluation of electrical characteristics of carbon nanotubes Maxime Darnon, Gerald W. Gibson, Pratik P. Joshi 2014-10-07
8828749 Methodology for evaluation of electrical characteristics of carbon nanotubes Maxime Darnon, Gerald W. Gibson, Pratik P. Joshi 2014-09-09
8822137 Self-aligned fine pitch permanent on-chip interconnect structures and method of fabrication Sanjay C. Mehta, Hosadurga Shobha 2014-09-02
8795556 Self-aligned permanent on-chip interconnect structure formed by pitch splitting 2014-08-05
8659115 Airgap-containing interconnect structure with improved patternable low-K material and method of fabricating 2014-02-25