Issued Patents All Time
Showing 151–171 of 171 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7060624 | Deep filled vias | Panayotis Andricacos, Emanuel I. Cooper, Timothy J. Dalton, Daniel Guidotti, Keith Kwietniak +2 more | 2006-06-13 |
| 7008871 | Selective capping of copper wiring | Panayotis Andricacos, Shyng-Tsong Chen, John M. Cotte, Mahadevaiyer Krishnan, Wei-Tsu Tseng +1 more | 2006-03-07 |
| 6977569 | Lateral microelectromechanical system switch | Christopher V. Jahnes, Jennifer Lund, Lawrence E. Larson | 2005-12-20 |
| 6974531 | Method for electroplating on resistive substrates | Panayotis Andricacos, Wilma Jean Horkans, Keith Kwietniak, Michael Lane, Sandra G. Malhotra +4 more | 2005-12-13 |
| 6967131 | Field effect transistor with electroplated metal gate | Katherine L. Saenger, Cyril Cabral, Jr., Emanuel I. Cooper, Panayotis Andricacos, Philippe M. Vereecken | 2005-11-22 |
| 6917268 | Lateral microelectromechanical system switch | Christopher V. Jahnes, Jennifer Lund, Lawrence E. Larson | 2005-07-12 |
| 6876282 | Micro-electro-mechanical RF switch | Panayotis Andricacos, L. Paivikki Buchwalter, Robert A. Groves, Christopher V. Jahnes, Jennifer Lund +4 more | 2005-04-05 |
| 6836029 | Micro-electromechanical switch having a conductive compressible electrode | David R. Greenberg, Robert A. Groves, Christopher V. Jahnes, Jennifer Lund, Katherine L. Saenger +1 more | 2004-12-28 |
| 6818843 | Microswitch with a micro-electromechanical system | Michael Meixner, Leena Paivikki Buchwalter, Jennifer Lund | 2004-11-16 |
| 6776885 | Integrated plating and planarization apparatus having a variable-diameter counterelectrode | Laertis Economikos, John M. Cotte, Panayotis Andricacos | 2004-08-17 |
| 6773570 | Integrated plating and planarization process and apparatus therefor | Laertis Economikos, John M. Cotte, Henry Grabarz, Bomy Chen | 2004-08-10 |
| 6709562 | Method of making electroplated interconnection structures on integrated circuit chips | Panayotis Andricacos, John O. Dukovic, Daniel C. Edelstein, Wilma Jean Horkans, Chao-Kun Hu +4 more | 2004-03-23 |
| 6685814 | Method for enhancing the uniformity of electrodeposition or electroetching | Cyprian Emeka Uzoh, John O. Dukovic | 2004-02-03 |
| 6639488 | MEMS RF switch with low actuation voltage | Robert A. Groves, Christopher V. Jahnes, Jennifer Lund, Panayotis Andricacos, John M. Cotte +3 more | 2003-10-28 |
| 6270646 | Electroplating apparatus and method using a compressible contact | Erick G. Walton, Dean S. Chung, Lara Sandra Collins, William E. Corbin, Jr., Daniel C. Edelstein +4 more | 2001-08-07 |
| 6261426 | Method and apparatus for enhancing the uniformity of electrodeposition or electroetching | Cyprian Emeka Uzoh, John O. Dukovic | 2001-07-17 |
| 6224690 | Flip-Chip interconnections using lead-free solders | Panayotis Andricacos, Madhav Datta, Wilma Jean Horkans, Sung Kwon Kang, Keith Kwietniak +4 more | 2001-05-01 |
| 6090710 | Method of making copper alloys for chip and package interconnections | Panayotis Andricacos, James M. E. Harper, Chao-Kun Hu, Dale J. Pearson, Scott K. Reynolds +2 more | 2000-07-18 |
| 6063506 | Copper alloys for chip and package interconnections | Panayotis Andricacos, James M. E. Harper, Chao-Kun Hu, Dale J. Pearson, Scott K. Reynolds +2 more | 2000-05-16 |
| 5874199 | Method of forming oversized solder bumps | William Hsioh-Lien Ma | 1999-02-23 |
| 5385661 | Acid electrolyte solution and process for the electrodeposition of copper-rich alloys exploiting the phenomenon of underpotential deposition | Panayotis Andricacos, I-Chia H. Chang, Wilma Jean Horkans | 1995-01-31 |