WM

William Hsioh-Lien Ma

IBM: 2 patents #32,839 of 70,183Top 50%
📍 Wappingers Falls, NY: #479 of 884 inventorsTop 55%
🗺 New York: #48,759 of 115,490 inventorsTop 45%
Overall (All Time): #2,246,763 of 4,157,543Top 55%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
5874199 Method of forming oversized solder bumps Hariklia Deligianni 1999-02-23
4187331 Fluorine plasma resist image hardening — 1980-02-05