DC

Dureseti Chidambarrao

IBM: 223 patents #132 of 70,183Top 1%
Globalfoundries: 2 patents #1,397 of 4,424Top 35%
MG Mentor Graphics: 2 patents #191 of 698Top 30%
Samsung: 2 patents #37,631 of 75,807Top 50%
Infineon Technologies Ag: 1 patents #4,439 of 7,486Top 60%
KT Kabushiki Kaisha Toshiba: 1 patents #13,537 of 21,451Top 65%
📍 Weston, CT: #1 of 210 inventorsTop 1%
🗺 Connecticut: #16 of 34,797 inventorsTop 1%
Overall (All Time): #2,436 of 4,157,543Top 1%
230
Patents All Time

Issued Patents All Time

Showing 201–225 of 230 patents

Patent #TitleCo-InventorsDate
6881635 Strained silicon NMOS devices with embedded source/drain Effendi Leobandung, Anda C. Mocuta, Haining Yang, Huilong Zhu 2005-04-19
6878978 CMOS performance enhancement using localized voids and extended defects Omer H. Dokumaci, Suryanarayan G. Hegde 2005-04-12
6872620 Trench capacitors with reduced polysilicon stress Rajarao Jammy, Jack A. Mandelman 2005-03-29
6873010 High performance logic and high density embedded dram with borderless contact and antispacer Omer H. Dokumaci, Bruce B. Doris, Oleg Gluschenkov, Rajarao Jammy, Jack A. Mandelman 2005-03-29
6872641 Strained silicon on relaxed sige film with uniform misfit dislocation density Omer H. Dokumaci 2005-03-29
6869866 Silicide proximity structures for CMOS device performance improvements Omer H. Dokumaci, Rajesh Rengarajan, An Steegen 2005-03-22
6858488 CMOS performance enhancement using localized voids and extended defects Omer H. Dokumaci, Suryanarayan G. Hegde 2005-02-22
6833305 Vertical DRAM punchthrough stop self-aligned to storage trench Jack A. Mandelman, Ramachandra Divakaruni 2004-12-21
6825529 Stress inducing spacers Omer H. Dokumaci, Bruce B. Doris, Jack A. Mandelman, Xavier Baie 2004-11-30
6803270 CMOS performance enhancement using localized voids and extended defects Omer H. Dokumachi, Suryanarayan G. Hegde 2004-10-12
6787838 Trench capacitor DRAM cell using buried oxide as array top oxide Ramachandra Divakaruni, Deok-kee Kim 2004-09-07
6777737 Vertical DRAM punchthrough stop self-aligned to storage trench Jack A. Mandelman, Ramachandra Divakaruni 2004-08-17
6740920 Vertical MOSFET with horizontally graded channel doping Kil-Ho Lee, Jack A. Mandelman, Kevin McStay, Rajesh Rengarajan 2004-05-25
6734056 Self-aligned punch through stop for 6F2 rotated hybrid DRAM cell Jack A. Mandelman 2004-05-11
6724031 Method for preventing strap-to-strap punch through in vertical DRAMs Hiroyuki Akatsu, Ramachandra Divakaruni, Jack A. Mandelman, Carl Radens 2004-04-20
6717216 SOI based field effect transistor having a compressive film in undercut area under the channel and a method of making the device Bruce B. Doris, Xavier Baie, Jack A. Mandelman, Devendra K. Sadana, Dominic J. Schepis 2004-04-06
6709926 High performance logic and high density embedded dram with borderless contact and antispacer Omer H. Dokumaci, Bruce B. Doris, Oleg Gluschenkov, Rajarao Jammy, Jack A. Mandelman 2004-03-23
6707095 Structure and method for improved vertical MOSFET DRAM cell-to-cell isolation Jack A. Mandelman, Carl Radens 2004-03-16
6703274 Buried strap with limited outdiffusion and vertical transistor DRAM Ramachandra Divakaruni, Jack A. Mandelman, Raymond Van Roijen 2004-03-09
6653678 Reduction of polysilicon stress in trench capacitors Rajarao Jammy, Jack A. Mandelman 2003-11-25
6573585 Electrically blowable fuse with reduced cross-sectional area Kenneth C. Arndt, Louis L. Hsu, Jack A. Mandelman, Carl Radens 2003-06-03
6573561 Vertical MOSFET with asymmetrically graded channel doping Ramachandra Divakaruni, Jack A. Mandelman, Kevin McStay 2003-06-03
6548358 Electrically blowable fuse with reduced cross-sectional area Kenneth C. Arndt, Louis L. Hsu, Jack A. Mandelman, Carl Radens 2003-04-15
6534824 Self-aligned punch through stop for 6F2 rotated hybrid DRAM cell Jack A. Mandelman 2003-03-18
6417572 Process for producing metal interconnections and product produced thereby Ronald G. Filippi, Robert Rosenberg, Thomas M. Shaw, Timothy D. Sullivan, Richard A. Wachnik 2002-07-09