DC

Dureseti Chidambarrao

IBM: 223 patents #132 of 70,183Top 1%
Globalfoundries: 2 patents #1,397 of 4,424Top 35%
MG Mentor Graphics: 2 patents #191 of 698Top 30%
Samsung: 2 patents #37,631 of 75,807Top 50%
Infineon Technologies Ag: 1 patents #4,439 of 7,486Top 60%
KT Kabushiki Kaisha Toshiba: 1 patents #13,537 of 21,451Top 65%
📍 Weston, CT: #1 of 210 inventorsTop 1%
🗺 Connecticut: #16 of 34,797 inventorsTop 1%
Overall (All Time): #2,436 of 4,157,543Top 1%
230
Patents All Time

Issued Patents All Time

Showing 226–230 of 230 patents

Patent #TitleCo-InventorsDate
6222244 Electrically blowable fuse with reduced cross-sectional area Kenneth C. Arndt, Louis L. Hsu, Jack A. Mandelman, Carl Radens 2001-04-24
6177286 Reducing metal voids during BEOL metallization Munir-ud-Din Naeem 2001-01-23
5773362 Method of manufacturing an integrated ULSI heatsink William R. Tonti, Jack A. Mandelman, Jerzy M. Zalesinski, Toshiharu Furukawa, Son V. Nguyen 1998-06-30
5729052 Integrated ULSI heatsink William R. Tonti, Jack A. Mandelman, Jerzy M. Zalesinski, Toshiharu Furukawa, Son V. Nguyen 1998-03-17
5470781 Method to reduce stress from trench structure on SOI wafer Louis L. Hsu, J. Daniel Mis, James Peng 1995-11-28